Integrated Waveguide Socket for Millimeter-Wave Signal Integrity
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Solution Overview
Problem
Conventional Automatic Test Equipment (ATE) systems experience signal loss at high frequencies due to elongated signal paths and large waveguide flanges, which limit the packing density of waveguides and degrade signal integrity.
Innovation Solution
The use of customizable waveguides integrated into a single structure with a shared flange allows for tight packing and reduced microstrip traces, minimizing signal loss by positioning waveguides close to the device under test and eliminating the need for intermediate flanges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional waveguide flanges are used to mate waveguides and tester electronics, then reliable electrical connection is achieved, but the large flange dimensions increase the signal path length and limit waveguide packing density
Solution Approach 1:
The waveguide structure is divided into modular segments that can be closely spaced, with each segment having its own optimized flange configuration. This segmentation allows the signal path to be broken into shorter segments while maintaining reliable connections at each interface.
Solution Approach 2:
The flange dimensions and geometry are modified from conventional designs to optimized parameters that minimize the distance between waveguide centers while maintaining adequate contact area for reliable electrical connection. The flange parameters are specifically tuned for millimeter wave frequencies.
2Stability of the object's composition
If conventional waveguide flanges are used, then stable mechanical connection is achieved, but the large flange size degrades signal integrity at high frequencies
Solution Approach 1:
The connection system is segmented into multiple smaller contact points distributed across the flange interface, which reduces the overall path length for signal transmission while maintaining mechanical stability through the distributed contact structure.
Solution Approach 2:
The flange design incorporates three-dimensional features such as raised contact surfaces or stepped configurations that reduce the effective signal path length in the critical dimension while maintaining adequate mechanical contact area for stable connection.
3Quantity of substance
If multiple waveguides are positioned close together, then waveguide packing density is improved, but conventional flanges prevent close mounting due to their large size
Solution Approach 1:
The flange structure is segmented into smaller sub-flanges or contact zones that can be positioned closer together, enabling higher waveguide packing density while maintaining adequate connection area for each individual waveguide interface.
Solution Approach 2:
The flange dimensions are reduced to optimized parameters that allow closer waveguide spacing. The contact area parameters are specifically adjusted to provide sufficient electrical and mechanical connection while minimizing the overall flange footprint.
4Adaptability or versatility
If longer microstrip transmission lines are used on PCBs to convey test signals, then signal path flexibility is improved, but signal loss increases at high frequencies
Solution Approach 1:
The microstrip transmission lines are extracted and replaced with waveguide structures for the critical high-frequency signal paths. This removes the lossy PCB transmission medium from the signal path while maintaining the necessary routing flexibility through waveguide bends and transitions.
Solution Approach 2:
Waveguide flanges serve as intermediary components that provide flexible mechanical positioning and routing capabilities while maintaining low-loss signal transmission. The flanges act as mediators between the rigid waveguide structure and the flexible positioning requirements.
Data Source
AI summary
A structure for signal transmission is disclosed. The structure comprises a first plurality of waveguides tightly disposed together and disposed substantially in parallel with each other, each of said waveguides having a first opening and a second opening, wherein each first opening is operable to align with a patch antenna, and wherein the first plurality of waveguides is disposed adjacent to a socket. The integrated structure further comprises the socket which comprises an opening operable to support an insertion of a device under test (DUT), wherein the DUT is communicatively coupled to a plurality of microstrip transmission lines on a printed circuit board (PCB) underlying the socket for transmitting test signals from the DUT, wherein each of the microstrip transmission lines is electrically coupled to a respective patch antenna. Further, the first plurality of waveguides and the socket are integrated into a single plastic or metal structure.