Integrated Wavelength Conversion Structure for Simpler Laser Lighting

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Solution Overview

Problem

Existing light-emitting devices with semiconductor laser elements and wavelength conversion members are costly, complex, and require a large number of parts and a sophisticated production process.

Innovation Solution

A light-emitting device design that integrates a semiconductor laser element with a wavelength conversion member, featuring a simpler structure with fewer parts and a streamlined production process, allowing for cost-effective manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional light-emitting device structure with separate reflective body and light-transmissive body is used, then light reflection and transmission functions are achieved, but the number of parts increases and production cost increases

Engineering Contradiction:
Improvelight reflection and transmission functionVSAvoidnumber of parts
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the reflective body and light-transmissive body into a single integrated component. The wavelength conversion member includes both a reflective portion and a light-transmissive portion, eliminating the need for separate reflective body and light-transmissive body components. This merging reduces the total number of parts while maintaining the light reflection and transmission functions.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If a conventional light-emitting device structure is used, then light emission function is achieved, but the production process becomes more sophisticated and costly

Engineering Contradiction:
Improvelight emission functionVSAvoidproduction process complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

By integrating multiple functions into the wavelength conversion member, the production process is simplified. Instead of assembling separate reflective body, light-transmissive body, and wavelength conversion member, the invention produces a single integrated component with all three functions, reducing manufacturing complexity and cost.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If separate reflective body and light-transmissive body are used, then optical functions are achieved, but production cost increases

Engineering Contradiction:
Improveoptical functionVSAvoidproduction cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The invention merges the reflective body and light-transmissive body into a single wavelength conversion member that performs both functions simultaneously. This integration reduces the number of components that need to be sourced, assembled, and quality-checked, thereby reducing production cost while maintaining optical performance.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed design reduces production costs, simplifies the manufacturing process, and minimizes the number of components, while maintaining effective light emission and safety features.

Implementation Method 1

a wavelength conversion member on which the light emitted from the light-transmissive body is incident

Methodology Applied
Scientific EffectPhosphorescence: Phosphorescence

Data Source

PatentEP4350908B1Light-emitting device
Publication Date: 2025.05.21 NICHIA CORP
  • EP4350908B1 patent drawingFigure 1~2
  • EP4350908B1 patent drawingFigure 3A~3B
  • EP4350908B1 patent drawingFigure 3C~3D

AI summary

A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion. The wavelength conversion portion includes a light incident surface and a light-emitting surface. The package includes a disposition region. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. The light-emitting surface has a shape that, in a plan view perpendicular to the light-emitting surface, has a first region decreasing in width in a second direction perpendicular to the first direction from the side closest to the semiconductor laser element toward the first direction.