Intelligent Buffer Chip for Memory Module RAS Features
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Solution Overview
Problem
Current memory systems lack effective reliability and serviceability features, making it difficult to quickly and easily identify failed memory modules and implement redundancy, leading to inefficient failure handling and increased costs.
Innovation Solution
Incorporating intelligent register and buffer chips into memory modules to implement Reliability and Serviceability (RAS) features, such as self-testing, memory sparing, mirroring, RAID, defect re-mapping, and advanced error handling, which enable autonomous operation and improved fault tolerance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional memory modules are used without RAS features, then the device complexity is low, but the reliability and ease of service are poor
Solution Approach 1:
An intelligent buffer chip is introduced as an intermediary component between the memory chips and the memory controller. This buffer chip implements RAS features including error detection, error correction, memory sparing, and defect re-mapping, thereby improving reliability without requiring complex changes to the entire memory system architecture.
Solution Approach 2:
The intelligent buffer chip provides self-service capabilities by autonomously performing self-testing, error correction, and defect management functions. This allows the memory module to detect and correct errors without external intervention, improving reliability while maintaining manageable complexity through automated operations.
2Ease of repair
If memory modules lack serviceability features, then the device complexity is low, but the ease of repair and failure identification are poor
Solution Approach 1:
The intelligent buffer chip implements feedback mechanisms that provide real-time status information about memory health, errors, and defects. This feedback enables quick identification of failed components and guides repair actions, significantly improving serviceability while the standardized feedback interfaces keep the added complexity manageable.
Solution Approach 2:
The intelligent buffer chip serves as an intermediary that manages complexity by centralizing serviceability functions. It handles defect re-mapping, error logging, and repair coordination, making the memory module easier to service without dispersing complexity across multiple components.
3Reliability
If no redundancy management is implemented, then the device complexity is low, but the fault tolerance and reliability are poor
Solution Approach 1:
The intelligent buffer chip implements preliminary actions by pre-configuring spare memory locations and defect re-mapping tables before failures occur. When errors are detected, the buffer chip automatically redirects access to spare locations, providing fault tolerance through pre-established redundancy management rather than reactive measures.
Solution Approach 2:
The intelligent buffer chip autonomously manages redundancy without external intervention. It performs self-testing to identify defects, automatically remaps defective locations to spare locations, and handles error correction, thereby improving fault tolerance while keeping redundancy management complexity contained within the buffer chip.
Data Source
AI summary
One embodiment of the present invention sets forth a memory module that includes at least one memory chip, and an intelligent chip coupled to the at least one memory chip and a memory controller, where the intelligent chip is configured to implement at least a part of a RAS feature. The disclosed architecture allows one or more RAS features to be implemented locally to the memory module using one or more intelligent register chips, one or more intelligent buffer chips, or some combination thereof. Such an approach not only increases the effectiveness of certain RAS features that were available in prior art systems, but also enables the implementation of certain RAS features that were not available in prior art systems.