Intelligent Inline Metrology for Semiconductor Wafer Inspection
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Solution Overview
Problem
Existing inline metrology systems waste resources by collecting measurements at all inspection sites, even when there is a high probability that they will be within specifications, and require manual handling of workpieces for troubleshooting, which increases costs and inefficiency.
Innovation Solution
An intelligent inline metrology tool with measurement, determination, and estimation modules that measure parameters at a first set of inspection sites, estimate parameters at a second set of sites if the first set meets specifications, and only measure at the second set if the estimates are out of specification, reducing unnecessary metrology capacity and manual handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If measurements are collected at all inspection sites, then measurement completeness is improved, but resource waste increases
Solution Approach 1:
The system performs partial measurements by collecting data at only a first set of inspection sites rather than all sites. When measurements at the first set indicate specifications are met, the system avoids excessive measurements at the second set of sites, thereby reducing resource waste while maintaining adequate measurement completeness for quality assurance
Solution Approach 2:
The inspection sites are segmented into a first set and a second set. The system measures at the first set of sites and uses those results to determine whether measurements at the second set are necessary. This segmentation allows the system to achieve measurement completeness where needed while avoiding unnecessary measurements elsewhere
2Difficulty of detecting and measuring
If manual handling is performed for troubleshooting, then fault detection capability is improved, but handling costs increase
Solution Approach 1:
The system performs self-diagnosis by automatically analyzing measurements from the first set of inspection sites and determining whether specifications are met. This self-service capability reduces the need for manual handling and troubleshooting, thereby lowering handling costs while maintaining fault detection capability
Solution Approach 2:
The system uses feedback from measurements at the first set of inspection sites to automatically determine whether further measurements at the second set are needed. This feedback mechanism enables the system to detect faults and make decisions without manual intervention, reducing handling costs while maintaining detection capability
Data Source
AI summary
A method for intelligent inline metrology is a provided. A parameter of a workpiece is measured at a first set of inspection sites on the workpiece. A determination is made as to whether a first specification is met using the measurements at the first set of inspection sites. In response to the first specification being met, the parameter is estimated at a second set of inspection sites on the workpiece. In response to the first specification being unmet, the parameter is measured at the second set of inspection sites and a determination is made as to whether a second specification is met using the measurements at the second set of inspection sites. A system for intelligent inline metrology is also provided.