Inter-Die Ground Connector Layout for Low-Crosstalk Packaging
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Solution Overview
Problem
Existing semiconductor package structures face challenges in reducing crosstalk between electronic components due to increasing integration density, which leads to increased conductive paths and parasitic inductance.
Innovation Solution
The introduction of an inter-die connector that forms an electrical connection between adjacent semiconductor dies, directly connecting their grounding lines without additional redistribution layers, thereby reducing the conductive path and minimizing crosstalk and parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If integration density of electronic components is increased, then more components can be integrated into a given area, but crosstalk between conductive paths increases
Solution Approach 1:
A ground shield structure is introduced as an intermediary element between adjacent conductive paths. This ground shield acts as a mediator that blocks electromagnetic interference and crosstalk between signal lines, allowing higher integration density without proportionally increasing crosstalk. The ground shield is positioned between conductive paths and connected to ground potential, creating an electromagnetic barrier that reduces harmful coupling between adjacent traces.
2Area of stationary object
If integration density is increased, then package area is reduced, but parasitic inductance in conductive paths increases
Solution Approach 1:
The solution moves the grounding function from a two-dimensional planar layout to a three-dimensional vertical structure. Ground shields are positioned vertically between conductive paths, extending in the thickness direction of the package. This vertical dimension allows ground connections to be made closer to signal lines without increasing planar area, thereby reducing loop area and parasitic inductance while maintaining small package footprint.
3Ease of manufacture
If conventional semiconductor package structures are used, then manufacturing is simpler, but crosstalk reduction is insufficient
Solution Approach 1:
The ground shield structure serves multiple functions simultaneously: it provides electromagnetic shielding between adjacent conductive paths, acts as a reference plane for signal routing, and offers additional ground connection points. This multi-functionality allows crosstalk reduction to be achieved without adding separate dedicated shielding structures, thereby maintaining manufacturing simplicity while effectively reducing crosstalk in high-density packages.
Data Source
AI summary
A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.