Inter-Die Message Compression for Low-Latency Multi-Die Processors
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Solution Overview
Problem
Existing processors face challenges with single die fabrication defects leading to impaired functionality, increased fabrication risks, and limitations in scalability and redundancy, which affect yield and performance.
Innovation Solution
Implementing a processor architecture that utilizes multiple physically separate dies connected by an interconnect to form a monolithic cache domain, allowing for redundancy, yield recovery, and scalability, with features like transparent queues and power domains to manage power and latency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single die is used for processor fabrication, then manufacturing simplicity is maintained, but fabrication defects lead to impaired functionality and reduced yield
Solution Approach 1:
The processor is divided into multiple physically separate dies (first die, second die, third die) that are interconnected through an interconnect. This segmentation allows individual dies to be manufactured separately, reducing the risk that a single fabrication defect will compromise the entire processor. If one die fails, others can continue to function, thereby improving reliability while maintaining ease of manufacture through modular fabrication.
2Reliability
If multiple physically separate dies are used, then redundancy and yield recovery are enabled, but device complexity increases
Solution Approach 1:
Multiple separate dies are merged into a unified processor system through an interconnect that allows them to function as a cohesive unit. The dies work together to execute instructions and share resources, creating a monolithic-like processor from modular components. This merging approach enables yield recovery by allowing functional dies to compensate for defective ones, while the unified architecture minimizes the perceived complexity for software and users.
3Adaptability or versatility
If multiple dies are interconnected, then scalability and redundancy are achieved, but interconnect bandwidth and latency become critical constraints
Solution Approach 1:
The interconnect is designed with differentiated characteristics for different types of data traffic. Request packets and response packets are handled with different priorities and routing mechanisms, optimizing the path and speed for each type of communication. This local quality approach ensures that critical data paths have minimal latency while allowing the overall system to scale by adding more dies without uniformly degrading performance across all interconnect paths.
Data Source
AI summary
Techniques for scenario-based compression, including a processor, comprising: a first die of a plurality of dies coupled over a first inter-die link to a second die, the first die comprising: message control registers to store message fields; message compression circuitry to compress a message transmitted over the first inter-die link, the first message compression circuitry to replace a message field in the message with an indication of a storage location of the message field in the first one or more message control registers; the second die comprising: second message control registers to store the message fields; message decompression circuitry to decompress the message received over the first inter-die link from the first die, the message decompression circuitry to identify the storage location of the message field in the second one or more message control registers based on the indication and to insert the message field in the message.