Inter-Module Ion Transport for Low-Fidelity-Loss Quantum Computers

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The transport of ions in trapped ion quantum computers introduces challenges such as loss of coherence, temperature gain, and phase accumulation, which lower the fidelity of information stored in qubits, limiting the scalability and reliability of quantum computing systems.

Innovation Solution

Implementing methods and systems for ion transport across inter-module gaps using voltage waveforms, sympathetic cooling techniques, and precise alignment of quantum computing modules to maintain low heat gain and high fidelity, along with mechanisms like shuttling and throw-and-catch to facilitate ion transport between modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If ions are transported across inter-module gaps between quantum computing modules, then modularity and scalability of the quantum computer are improved, but temperature gain and phase accumulation occur which reduce fidelity

Engineering Contradiction:
ImprovemodularityVSAvoidfidelity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent introduces intermediary mechanisms including voltage waveforms that create pseudopotential paths to guide ion transport, and sympathetic cooling agents (coolant ions) that mediate heat transfer from transported ions. These intermediaries enable modular architecture while maintaining fidelity by managing the thermal and phase effects during inter-module transport.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent dynamically changes multiple parameters during ion transport including voltage waveform amplitudes and frequencies, pseudopotential well depths, and coolant ion temperatures. By adjusting these parameters in real-time, the system maintains optimal transport conditions that minimize temperature gain and phase accumulation while enabling modular scalability.

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If ions are transported over gaps or discontinuities in electrode structure, then device complexity is reduced through modular design, but heat gain increases which affects computation accuracy

Engineering Contradiction:
Improvemodular designVSAvoidheat gain
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

Coolant ions serve as intermediary thermal management agents that absorb heat from transported ions through Coulombic interactions. This intermediary cooling mechanism enables modular electrode designs with gaps and discontinuities while maintaining low heat gain during ion transport operations.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system performs preliminary cooling actions by pre-positioning coolant ions in strategic locations before ion transport occurs. This preliminary preparation ensures that heat gain is minimized during the actual transport process, enabling modular electrode structures without compromising thermal management.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If sympathetic cooling techniques are applied to cool ions after transport, then temperature is reduced and fidelity is improved, but additional time is required for the cooling process

Engineering Contradiction:
ImprovefidelityVSAvoidcooling time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent implements continuous sympathetic cooling where coolant ions continuously interact with transported ions during and after the transport process. This continuous cooling action reduces the total cooling time required while maintaining high fidelity, as the cooling process begins before transport completes and continues seamlessly.

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The system uses self-service cooling where coolant ions automatically cool transported ions through natural Coulombic interactions without requiring additional active control interventions. This self-service mechanism reduces processing time while maintaining cooling effectiveness and high fidelity.

Inventive Principle:
Principle #25Self-service

4Reliability

If voltage waveforms are updated based on ion temperature measurements, then transport fidelity is improved, but system operation complexity increases

Engineering Contradiction:
Improvetransport fidelityVSAvoidcontrol system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements feedback control where ion temperature is measured during transport and this information feeds back to dynamically adjust voltage waveforms. This feedback loop improves transport fidelity by compensating for thermal effects in real-time, while the automated feedback mechanism manages the complexity through systematic control algorithms.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables high-fidelity, modular, and scalable trapped-ion quantum computers with reduced temperature increase and phase accumulation, allowing for larger qubit counts and fault-tolerant operation by enabling live recalibration and maintenance of quantum computing modules.

Implementation Method 1

transporting an ion across an inter-module gap using a voltage waveform

Methodology Applied
Scientific EffectElectromagnetic force: Lorentz Force

Implementation Method 2

cooling the ion using a sympathetic cooling technique... the coolant ion coulombically interacts with the ion

Methodology Applied
Scientific EffectCoulombic interaction: Coulomb's Law

Data Source

PatentUS20260004176A1Methods and systems for inter-module transport in trapped ion quantum computers
Publication Date: 2026.01.01 UNIVERSAL QUANTUM LTD
  • US20260004176A1 patent drawing
  • US20260004176A1 patent drawing
  • US20260004176A1 patent drawing

AI summary

Disclosed herein are trapped-ion quantum computers, trapped-ion quantum computing modules, and techniques and methods for inter-module ion transport. A trapped-ion quantum computer, may comprise a plurality of quantum computing modules, wherein each module of the plurality of quantum computing modules is fabricated on a substrate, wherein feature electrode structures on a module of the plurality of quantum computing modules extend at least partially to an edge of an inter-module gap, and wherein an ion is transported across the inter-module gap with a temperature increase of less than about 100 motional quanta and a transfer infidelity rate of less than about 0.01.