Inter-stage Test Structure for Wireless SOC Impedance Detection
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Solution Overview
Problem
Conventional testing instruments find it difficult to detect defective components in wireless communication devices, leading to the unnecessary scrapping of entire System-on-Chip (SOC) units, which is wasteful and increases manufacturing costs.
Innovation Solution
An inter-stage test structure is introduced, comprising a unit under test (UUT), ground wires, signal wires, and an intermediate layer with air and impedance-adjusting cavities, allowing for the detection of UUT conditions by measuring impedance ratios, enabling the replacement of only the defective component rather than the entire apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional testing instruments are used to detect defective components in wireless communication devices, then the entire SOC is scrapped when a defect is detected, but this leads to waste of functional components and increased manufacturing costs
Solution Approach 1:
The patent segments the testing process by introducing an intermediate layer with multiple test pads that can independently test different components (UUTs) within the SOC. This allows the testing function to be divided into separate testable units, enabling identification of specific defective components rather than treating the entire SOC as a single testable entity.
Solution Approach 2:
The intermediate layer acts as an intermediary between the upper board (containing test instruments) and the lower board (containing the SOC). This intermediate layer provides a bridge that enables detailed component-level testing through multiple test pads, allowing conventional testing instruments to detect specific defective components without scrapping the entire SOC.
2Ease of manufacture
If the entire SOC is scrapped when a defect is detected, then manufacturing costs are reduced by avoiding further processing, but this increases overall manufacturing costs due to waste
Solution Approach 1:
The patent performs preliminary testing at the component level within the SOC using the intermediate layer structure. By conducting detailed tests on individual UUTs before final assembly or packaging, the system can identify defective components early and selectively replace only those components, avoiding the need to scrap entire SOCs and improving manufacturing efficiency.
3Measurement precision
If detailed component-level testing is implemented, then defective components can be precisely identified, but the device complexity increases
Solution Approach 1:
The intermediate layer creates a simplified test interface that copies or replicates the essential testing functions needed for component-level detection. The test pads on the intermediate layer provide a simplified connection interface between test instruments and the SOC, enabling precise defect detection without requiring complex direct connections to each component within the SOC.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise identification and replacement of defective components, significantly reducing manufacturing costs by avoiding the disposal of entire wireless communication apparatuses.
Implementation Method 1
air inside of the air cavity generates an air impedance
Implementation Method 2
The conductive paste is disposed on the lower board and is configured for electrically connecting the first ground pad to the second ground pad
Data Source
AI summary
An inter-stage test structure for a wireless communication apparatus is provided. The wireless communication apparatus has a unit under test (UUT) and a next-stage component connected to the UUT through a signal wire. The inter-stage test structure is disposed on the signal wire and electrically connects the UUT to the next-stage unit component. The inter-stage test structure includes an upper board, a lower board, and an intermediate layer. The intermediate layer is disposed between the upper board and the lower board. The intermediate layer includes a first region and a second region defined thereon. The first region has an air cavity for generating an air impedance. The second region has an impedance adjusting cavity for generating an adjustable impedance. Accordingly, the inter-stage test structure can detect the condition of the UUT of the wireless communication apparatus based on the air impedance and the adjustable impedance.