Inter-Substrate Conducting Structure for Narrow Frame Displays
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Solution Overview
Problem
Existing display devices face challenges in minimizing the frame width due to the need for mounting a circuit board for connecting detection electrodes, which complicates the inter-substrate conducting structure and hinders the narrowing of the frame.
Innovation Solution
The implementation of a display device with a first and second substrate, where the second end surface of the second substrate includes a flat portion and a concave portion, allowing a connecting material to electrically connect the conductive layers, thereby eliminating the need for a circuit board and enabling a more compact inter-substrate conducting structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circuit board is mounted to connect detection electrodes between substrates, then electrical connection is achieved, but the frame width increases and device complexity increases
Solution Approach 1:
The invention extracts and eliminates the circuit board from the display device structure by implementing direct electrical connection between substrates through conductive layers and connection holes, thereby removing the component that increases frame width while maintaining electrical connection functionality
Solution Approach 2:
The invention merges the electrical connection function previously performed by the circuit board directly into the substrate structure through conductive layers and connection holes, integrating multiple functions into a compact design that reduces overall device dimensions
2Reliability
If a circuit board is mounted to connect detection electrodes, then electrical connection is achieved, but device complexity increases
Solution Approach 1:
The invention removes the circuit board component entirely, extracting the electrical connection function from a separate component and integrating it directly into the substrate structure, thereby reducing device complexity
Solution Approach 2:
The invention combines the electrical connection function with the substrate structure itself through conductive layers and connection holes, merging previously separate functions into a unified structure that simplifies the overall device architecture
3Reliability
If connecting material is provided in a concave portion, then electrical connection reliability is improved and air bubbles are reduced, but manufacturing complexity increases
Solution Approach 1:
The invention performs preliminary action by forming the concave portion in advance during substrate fabrication, which later facilitates easy filling with connecting material and reduces air bubble formation, while the concave portion itself is created using standard manufacturing techniques
Solution Approach 2:
The invention changes the geometric parameters of the connection structure by introducing a concave portion with specific depth and width ratios, optimizing the filling characteristics of the connecting material to reduce air bubbles while maintaining compatibility with existing manufacturing processes
Data Source
AI summary
According to one embodiment, a display device includes a first substrate including a first basement and a first conductive layer, a second substrate including a second basement and a second conductive layer, and a display function layer. A second end surface of the second basement includes a flat portion located in a same plane as a first end surface of the first basement, and a first concave portion formed toward an inside of the second basement with respect to the flat portion. A connecting material which electrically connects the first conductive layer and the second conductive layer is provided in the first concave portion.