Inter-Substrate Conducting Structure with Protrusion Guide

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Solution Overview

Problem

Existing display devices face challenges in efficiently and cost-effectively connecting conductive layers between substrates due to the risk of connecting materials spreading beyond desired boundaries, which affects the reliability and efficiency of the inter-substrate conducting structure.

Innovation Solution

The implementation of a display device design featuring a first substrate with a conductive layer and a second substrate with a conductive layer having an elongated protrusion around a hole, where the connecting material comes into contact with the protrusion to ensure precise and reliable electrical connection between the substrates, reducing the need for additional wiring substrates and minimizing frame width.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a through hole is provided on the CF side substrate and filled with connecting conductor, then electrical connection between substrates is achieved, but the connecting conductor spreads over the substrate surface beyond the desired range

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidconnecting conductor position precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a protrusion structure on the second conductive layer as an intermediary element between the through hole and the connecting conductor. This protrusion acts as a mediator that guides and confines the connecting conductor during filling, preventing it from spreading beyond the desired range while ensuring reliable electrical connection.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies local quality by creating a protrusion with specific geometric characteristics (higher than surrounding surfaces) at the precise location where connecting conductor containment is needed. This localized structural modification provides different properties (containment and guidance) only where required, without affecting other areas of the substrate.

Inventive Principle:

Principle #3Local quality

2Reliability

If additional wiring substrates are used to ensure reliable connection, then connection reliability improves, but device complexity and frame width increase

Engineering Contradiction:

Improveinter-substrate connection reliabilityVSAvoidwiring substrate quantity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the functions of multiple separate wiring substrates into a single integrated structure. By forming protrusions directly on the second conductive layer of the second substrate, the design combines the wiring and connection guidance functions into one element, eliminating the need for additional dedicated wiring substrates.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The second conductive layer is given multiple functions: it serves as both the electrical connection layer and the structural guide (via protrusions) for the connecting conductor. This multi-functionality eliminates the need for separate wiring substrates, reducing device complexity while maintaining connection reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Productivity

If the frame width is reduced to improve display efficiency, then manufacturing efficiency improves, but the space for inter-substrate connection structures is reduced

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidconnection structure space

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The patent transitions from a planar connection structure to a three-dimensional structure by creating protrusions that extend vertically from the second conductive layer. This dimensional change allows the connection structure to occupy vertical space rather than horizontal space, enabling frame width reduction while maintaining adequate connection structure area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The protrusion structure is nested within the existing second conductive layer, utilizing the vertical dimension above the substrate surface. This nesting approach allows the connection guidance structure to be embedded within the existing device architecture without requiring additional lateral space, thus maintaining manufacturing efficiency while reducing frame width.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS10091877B2Display device and inter-substrate conducting structure

Publication Date: 2018.10.02 MAGNOLIA WHITE CORP

AI summary

According to one embodiment, a display device includes a first substrate, a second substrate, and a connecting material. The first substrate includes a first basement and a first conductive layer. The second substrate includes a second basement and a second conductive layer. The first main surface is opposed to the first conductive layer and is spaced apart from one conductive layer. The second conductive layer provided on the second main surface has a first elongated protrusion. The connecting material comes into contact with the first elongated protrusion and the first conductive layer. The first elongated protrusion is disposed around the hole and surrounds the hole.