Interbonded Component Assembly for Selective Sequential Detachment
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Solution Overview
Problem
The increasing miniaturization of electronic and optoelectronic components poses challenges in the transfer process, particularly in terms of positioning accuracy, requiring improved methods for securely attaching and detaching components from a carrier while ensuring reliable transfer without misalignment or damage.
Innovation Solution
A component assembly is designed with a connecting layer that forms supporting structures for each component, and a sacrificial layer is used with varying thickness and material composition between the components and the carrier, allowing for a multistep detachment process where components of different groups can be selectively removed based on detachment force, ensuring precise and reliable transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform sacrificial layer is used for all components, then the detachment process is simple, but all components must be detached with the same force which reduces reliability for miniaturized components
Solution Approach 1:
The patent applies local quality by configuring sacrificial layers with different thicknesses for different groups of components on the same carrier. Specifically, first sacrificial layers have a first thickness for first groups of components, while second sacrificial layers have a second thickness for second groups of components. This allows selective detachment of different component groups with different forces, improving transfer reliability for miniaturized components while managing process complexity through systematic variation rather than complete uniformity.
2Reliability
If components are detached with high force to ensure secure transfer, then transfer reliability improves, but components with manufacturing tolerances may be damaged
Solution Approach 1:
The patent applies parameter changes by varying the thickness parameter of sacrificial layers across different component groups. By controlling sacrificial layer thickness, the detachment force required for each component group is precisely adjusted. This allows components with tighter manufacturing tolerances to be detached with lower forces that prevent damage, while other components can withstand higher detachment forces, thereby maintaining both transfer reliability and component integrity.
3Productivity
If all components are detached simultaneously, then productivity is high, but positioning accuracy decreases due to misalignment risks
Solution Approach 1:
The patent applies segmentation by dividing components into multiple groups (first groups and second groups) with different sacrificial layer configurations. This enables sequential detachment where first groups are detached in a first step and second groups are detached in a second step. The segmented approach maintains high productivity by processing multiple components systematically while improving positioning accuracy by eliminating misalignment risks associated with simultaneous detachment of all components.
4Reliability
If sacrificial layer thickness is increased to ensure complete coverage, then component support is improved, but detachment force required increases and may damage components
Solution Approach 1:
The patent applies local quality by implementing spatially varying sacrificial layer thicknesses tailored to specific component groups. Rather than uniformly increasing thickness across all components, the invention configures first sacrificial layers with a first thickness for first groups of components and second sacrificial layers with a second thickness for second groups. This localized approach ensures each component group receives adequate support while requiring only the necessary detachment force, preventing damage to sensitive miniaturized components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of the transfer process by allowing only specific components to be detached in the first step, reducing the risk of misalignment and damage, and enables sequential transfer of all components by adjusting the sacrificial layer's material removal, ensuring high precision and accuracy in the transfer of even the smallest components.
Implementation Method 1
The sacrificial layer is intended to be removed, for example by means of a chemical method, before the detachment of the components from the component assembly
Data Source
AI summary
In an embodiment a component assembly includes a plurality of components, a carrier, wherein the components are secured on the carrier by a connecting layer, wherein, for each component, the connecting layer forms at least one supporting structure at which the connecting layer is adjacent to the component, and a sacrificial layer arranged regionally between the components and the connecting layer, wherein one portion of the components is assigned to a first group, wherein a further portion of the components is assigned to a second group, and wherein the components of the first group are different than the components of the second group in respect of a coverage with the sacrificial layer.