Interchangeable Etching Chambers for Continuous Semiconductor Processing

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Solution Overview

Problem

The existing wafer etching process is inefficient due to the time-consuming cleaning of chamber byproducts, which interrupts the etching process and reduces productivity.

Innovation Solution

A semiconductor processing device with interchangeable etching chambers and a transfer module that allows simultaneous wafer etching and cleaning by switching between identical etching chambers, enabling continuous etching while one chamber is cleaned.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the chamber is cleaned to remove byproducts, then the chamber is cleaned, but the chamber cannot etch other wafers during cleaning time

Engineering Contradiction:

Improvechamber cleanlinessVSAvoidwafer etching productivity

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The system is divided into multiple etching chambers (first etching chamber, second etching chamber) that can operate independently. While one chamber is being cleaned, another chamber continues the etching process, eliminating the downtime associated with cleaning a single chamber.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cleaning process and etching process are merged in time by using multiple chambers. The cleaning of one chamber occurs simultaneously with the etching operation in another chamber, allowing both functions to be performed without sequential interruption.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If the cleaning process is performed, then byproducts are removed, but the etching process is interrupted

Engineering Contradiction:

Improvechamber cleanlinessVSAvoidetching process continuity

Core Design Contradiction:

ReliabilityVSDuration of action of moving object

Solution Approach 1:

The etching system is segmented into multiple independent chambers, allowing the cleaning operation in one chamber to occur without affecting the continuous operation of other chambers.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The useful action of wafer etching continues uninterrupted by performing cleaning operations in parallel in separate chambers, ensuring that the overall etching process maintains continuous productivity.

Inventive Principle:

Principle #20Continuity of useful action

3Device complexity

If a single etching chamber is used, then the device is simple, but cleaning time reduces overall efficiency

Engineering Contradiction:

Improvenumber of etching chambersVSAvoidwafer etching productivity

Core Design Contradiction:

Device complexityVSProductivity

Solution Approach 1:

The system uses multiple etching chambers that can be independently operated and cleaned. This segmentation allows one chamber to be cleaned while others remain productive, improving overall system efficiency despite increased complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple etching chambers provide multi-functionality, where each chamber can perform both etching and cleaning operations independently, allowing the system to maintain productivity while accommodating necessary maintenance activities.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS11393704B2Semiconductor processing device

Publication Date: 2022.07.19 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor processing device includes a first etching chamber, a second etching chamber, and an etching module. The etching module is adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching. A semiconductor process using the semiconductor processing device is also provided.