Interchangeable Vacuum Chuck Top Plate for Rapid Substrate Exchange
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Solution Overview
Problem
The existing substrate chucking systems require multiple chucks for different substrate shapes and sizes, leading to time-consuming interchanging and calibration processes, and incur high costs due to fabrication and purging of contaminants.
Innovation Solution
A vacuum-held, detachable top plate system with shared fluidic pathways for vacuum seals and air purging, allowing quick interchange and reduced component count, utilizing a detachable plate with reservoirs and channels for secure substrate attachment and environmental purging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple substrate chucks are used for different substrate shapes and sizes, then substrate review capability is improved, but time consumption for interchanging and calibrating increases
Solution Approach 1:
The patent implements a universal chuck body that can accommodate multiple substrate shapes and sizes through a single interface design. The standardized interface allows different substrate types to be reviewed on the same chuck without requiring physical interchange of chuck components, thereby maintaining versatility while eliminating time-consuming replacement and calibration operations.
2Adaptability or versatility
If multiple substrate chucks are fabricated for different substrate types, then substrate review capability is improved, but fabrication cost increases
Solution Approach 1:
The patent employs a single chuck body design with a universal interface that can handle multiple substrate types. This eliminates the need to fabricate separate chucks for different substrate shapes and sizes, significantly reducing manufacturing costs while maintaining the capability to review various substrate types through interface compatibility alone.
3Reliability
If traditional substrate chuck systems are used, then substrate securing is achieved, but system complexity and space requirements increase
Solution Approach 1:
The patent segments the chuck system into a reusable base chuck body and interchangeable substrate-specific components. This segmentation allows the complex substrate securing functionality to be isolated to small, manageable interface elements rather than requiring complete chuck replacements, thereby reducing overall system complexity while maintaining reliable substrate securing through dedicated interface designs for each substrate type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates rapid substrate exchange with reduced costs and space requirements by using a detachable plate with shared fluidic pathways for vacuum seals and purging, enhancing efficiency in semiconductor wafer review systems.
Implementation Method 1
the detachable plate is configured to establish fluidic connection between the one or more first reservoirs on the backside portion of the detachable plate and the one or more base-plate inlet channels for forming a first vacuum seal between the detachable plate and the base
Implementation Method 2
the detachable plate includes one or more pass-through channels for fluidic connection with the one or more base-substrate inlet channels to establish fluidic connection between the one or more second reservoirs on the frontside portion of the detachable plate for forming a second vacuum seal between the detachable plate and the substrate
Implementation Method 3
the air supply sub-system includes an air purge sub-system configured to purge an environment around the substrate
Data Source
AI summary
An apparatus for securing a substrate includes a detachable plate configured to reversibly attach to a base of a chuck. One or more portions of a common fluidic pathway are shared for receiving air (e.g., purging air), and for a formation of a first vacuum seal and a second vacuum seal. The base of the chuck includes one or more base-substrate inlet channels and one or more base-plate inlet channels. The detachable plate includes one or more first reservoirs and second reservoirs and is configured to establish a fluidic connection between the one or more first reservoirs and the base-plate inlet channels for forming a first vacuum seal between the detachable plate and the base. The detachable plate includes pass-through channels for fluidic connection with the one or more second reservoirs for forming a second vacuum seal between the detachable plate and a substrate.