Interconnect Apparatus for Substrates in Different Planes
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Solution Overview
Problem
Conventional methods face difficulties in interconnecting bonding pads located in different planes due to the varying thicknesses of circuit substrates in electronic assemblies, such as touch screens, where the control circuit substrate is thicker than the sensing electrodes and their intermediate carriers.
Innovation Solution
An interconnect apparatus with conductive springs and a body mechanism that mechanically and electrically connects bonding pads across substrates in different planes, utilizing slots, countersunk portions, and snap geometry to secure the apparatus in place, allowing for reliable electrical contact between circuits on disparate planes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional means are used to interconnect bonding pads, then the bonding pads must be in the same plane, but this cannot accommodate substrates of different thicknesses
Solution Approach 1:
The patent transitions from planar bonding pad connections to three-dimensional spring element connections. The spring elements extend vertically between bonding pads at different heights, enabling electrical connection across substrates of different thicknesses by utilizing the vertical dimension rather than requiring coplanar bonding surfaces.
Solution Approach 2:
The spring elements serve as intermediary components between the bonding pads on different substrates. These conductive springs mechanically and electrically bridge the gap between bonding pads at different planes, allowing connection without requiring the bonding pads to be in the same plane.
2Shape
If bonding pads are placed at different perpendicular distances from the substrate surface, then substrates of different thicknesses can be used, but conventional interconnection methods cannot realize this
Solution Approach 1:
The spring elements provide dynamic, flexible connection rather than rigid fixed-position bonding. The springs can compress and extend to accommodate variations in bonding pad positions and substrate thicknesses, making the interconnection process more tolerant of manufacturing tolerances and easier to assemble.
Solution Approach 2:
The patent changes the physical state of the connection from rigid (conventional bonding) to elastic (spring elements). This parameter change allows the connection to adapt to different bonding pad positions at varying perpendicular distances from substrate surfaces, facilitating easier manufacturing and assembly.
3Adaptability or versatility
If the control circuit substrate is substantially thicker than the sensing electrode substrate, then functional integration is achieved, but the bonding pads lie in substantially different planes
Solution Approach 1:
The spring elements change the connection parameter from rigid fixed-position to elastic adjustable-position. This allows the system to accommodate the thickness disparity between control circuit substrate and sensing electrode substrate while maintaining functional integration, reducing the impact of alignment precision requirements.
Solution Approach 2:
The solution moves from two-dimensional planar bonding to three-dimensional vertical spring connections. The spring elements extend in the vertical dimension to bridge the height difference caused by substrate thickness variations, enabling functional integration without requiring precise alignment of bonding pads in the same plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective electrical connection between bonding pads on substrates in different planes, overcoming the thickness disparity and facilitating the integration of sensing electrodes and control circuits in electronic assemblies like touch screens.
Implementation Method 1
conductive springs (24) extending from body (26)... spring elements (24) are mechanically and electrically engaged with portions of first circuit (14) and portions of second circuit (20), thereby electrically connecting such portions
Implementation Method 2
conductive springs (24)... spring elements (24) are mechanically and electrically engaged... body (26) is mechanically engaged with at least one of first substrate (12) and second substrate (16)
Data Source
AI summary
An interconnect apparatus for interconnecting electrical components includes a body and a spring element retained by and extending from the body. The apparatus is configured so that a portion thereof may be captured between first and second substrates and to connect electrical circuits lying in different planes.