Interconnect Bond Shear Testing with Adaptive Surface Profiling
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Solution Overview
Problem
Conventional shear tests on interconnect bonds in electronic devices fail to accurately measure bond strength due to surface inclination and deformation, leading to inaccurate results.
Innovation Solution
A method and apparatus that determine a shearing path based on the surface profile of interconnect bonds, ensuring the shear test tool moves at a constant distance from the surface profile to accurately measure bond strength, regardless of surface inclination or warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional shear test tool moves along a horizontal path to contact the interconnect bond, then the test procedure is simple and standardized, but the measurement precision deteriorates due to surface inclination and deformation
Solution Approach 1:
The system performs preliminary surface profiling to map the three-dimensional surface geometry before conducting the shear test. This preliminary action enables the shear test tool to pre-calculate and follow an optimized path that compensates for surface inclination and deformation, ensuring accurate bond strength measurement while maintaining operational simplicity through automated path planning.
Solution Approach 2:
The invention transitions from a two-dimensional horizontal test path to a three-dimensional adaptive path that follows the surface profile. By adding the vertical dimension and using depth information from surface profiling, the system creates a shearing path that maintains constant contact with the surface despite inclination and warpage, thereby improving measurement precision without significantly increasing operational complexity.
2Measurement precision
If the shear test is conducted on an inclined or warped surface using a conventional horizontal approach, then the testing process remains straightforward, but the measurement precision deteriorates due to surface irregularities
Solution Approach 1:
The system enables self-service by automatically adapting the shear test path to the actual surface profile without requiring manual intervention or complex operator skill. The surface profiling and automated path planning systems allow the test apparatus to self-adjust to inclined or warped surfaces, maintaining operational simplicity while significantly improving measurement precision through intelligent automation.
3Adaptability or versatility
If a fixed horizontal shearing path is used for all surfaces, then the test methodology is simple and consistent, but the measurement precision deteriorates when surfaces are non-flat or inclined
Solution Approach 1:
The system implements dynamics by transitioning from a fixed horizontal shearing path to a dynamic, adaptive path that automatically adjusts based on real-time surface profile data. The shear test apparatus uses surface profiling information to dynamically recalculate and follow an optimized three-dimensional path, enabling versatility across different surface conditions while managing complexity through automated adaptive control.
Data Source
AI summary
A shear test is conducted on an interconnect bond formed on a surface of an electronic device by first determining a profile of the surface, and based on the determined profile, determining a shearing path which is at a substantially constant distance from the profile of the surface for a shear test tool to conduct the shear test on the interconnect bond. The shear test tool is then guided to move along the determined shearing path to measure a shear force of the interconnect bond.