Interconnect Bonded Structure for Die Alignment and Signal Routing
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Solution Overview
Problem
In electronic component manufacturing, misalignments between conductive portions of a redistribution layer (RDL) and contact pads of integrated device dies lead to alignment issues in reconstituted wafers, particularly when multiple dies are stacked, complicating signal routing and interconnects.
Innovation Solution
Direct bonding of device dies to an interconnect structure serving as an alignment layer, using dielectric-to-dielectric and conductor-to-conductor bonding techniques without adhesives, to ensure precise alignment and electrical connectivity, with the interconnect structure acting as a redistribution layer (RDL) for signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a deposition process is used to form the RDL, then the RDL can be formed on the electronic component, but misalignments occur between the conductive portions of the RDL and contact pads of the electronic component
Solution Approach 1:
The patent applies preliminary action by forming the RDL on the electronic component before the deposition process, establishing a reference structure in advance. This allows the RDL to serve as a stable baseline for subsequent alignment operations, preventing misalignment issues that would otherwise occur during the deposition process.
Solution Approach 2:
The patent introduces an intermediary alignment layer between the RDL and the contact pads. This alignment layer acts as a mediator that facilitates precise registration between the conductive portions of the RDL and the contact pads, eliminating the misalignment problem inherent in direct deposition processes.
2Productivity
If multiple device dies are stacked to increase density, then integration capacity improves, but alignment issues compound and signal routing becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the stacking process into discrete, independently alignable units. Each device die is aligned and bonded to the RDL separately using the alignment layer as a reference, rather than attempting to align multiple dies simultaneously. This segmented approach prevents alignment errors from compounding across multiple stacked layers.
Solution Approach 2:
The alignment layer serves as a recurring intermediary between each die and the RDL in the stacked structure. This mediator ensures that each die maintains precise alignment with the underlying RDL, regardless of the number of dies in the stack, thereby maintaining manufacturing precision while increasing integration capacity.
3Adaptability or versatility
If complex multi-layer structures are used to route signals, then signal distribution capability improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies universality by designing the alignment layer to perform multiple functions simultaneously: it provides mechanical alignment reference, electrical connectivity, and signal routing capability. This multi-functional approach enables efficient signal distribution without requiring separate complex multi-layer structures, thereby reducing overall device complexity while maintaining versatility.
Data Source
AI summary
A bonded structure is disclosed. The bonded structure can include an interconnect structure that has a first side and a second side opposite the first side. The bonded structure can also include a first die that is mounted to the first side of the interconnect structure. The first die can be directly bonded to the interconnect structure without an intervening adhesive. The bonded structure can also include a second die that is mounted to the first side of the interconnect structure. The bonded structure can further include an element that is mounted to the second side of the interconnect structure. The first die and the second die are electrically connected by way of at least the interconnect structure and the element.