Interconnect Bridge Substrates With Through-Bridge Vias for Dense Die Links

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Solution Overview

Problem

The challenges in semiconductor manufacturing include unwanted material interactions, precision and scaling requirements, power delivery, limited failure tolerance, and material and manufacturing costs, particularly in the context of miniaturized and high-performance semiconductor devices that require sophisticated packaging solutions with fine-pitched die-to-die interconnections.

Innovation Solution

The integration of interconnect bridges, such as Embedded Multi-die Interconnect Bridges (EMIBs), within package substrates enables high-density die-to-die connections by embedding through-bridge vias (TBVs) that reduce substrate routing layers and improve packaging yields, using materials like silicon substrates, glass substrates, and polymer substrates with conductive traces and vias.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If interconnect bridges are embedded in package substrates to enable high-density die-to-die connections, then packaging efficiency and yields are improved, but device complexity and manufacturing precision requirements increase

Engineering Contradiction:

Improvepackaging efficiencyVSAvoidstructure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The package substrate is segmented into distinct regions: interconnect bridge regions with high-density through-bridge vias for die-to-die connections, and standard routing regions for other connections. This segmentation allows optimization of each region independently, achieving high packaging efficiency while managing complexity through modular design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate exhibits local quality variations with different via densities and routing configurations in different regions. Interconnect bridge regions have concentrated through-bridge vias for high-density connections, while other regions use standard routing. This local differentiation improves packaging efficiency for critical connections without unnecessarily increasing overall device complexity.

Inventive Principle:

Principle #3Local quality

2Device complexity

If through-bridge vias are used for direct die-to-die connections, then the number of substrate routing layers is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improverouting layersVSAvoidvia alignment precision

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

Through-bridge vias are formed and positioned in predetermined locations on the substrate before die attachment. This preliminary action establishes fixed, precise connection points that guide subsequent die placement and bonding, reducing the need for complex post-assembly routing while managing precision requirements through pre-planned via locations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The through-bridge vias act as intermediaries that directly connect corresponding pads on different dies, eliminating the need for multiple intermediate substrate routing layers. This direct connection approach reduces routing layer complexity while concentrating precision requirements into specific via formation and alignment steps.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Area of moving object

If fine-pitched die-to-die interconnections are implemented, then form factor miniaturization is achieved, but unwanted material interactions and failure risks increase

Engineering Contradiction:

Improvepackage form factorVSAvoidfailure tolerance

Core Design Contradiction:

Area of moving objectVSReliability

Solution Approach 1:

Through-bridge vias extract the connection function directly from the substrate routing system, creating dedicated, isolated interconnect paths between dies. This extraction separates critical die-to-die connections from other substrate routing, reducing unwanted material interactions and improving reliability for fine-pitched connections while enabling form factor miniaturization.

Inventive Principle:

Principle #2Taking out (Extraction)

4Adaptability or versatility

If heterogeneous dies are connected on a single package, then integration levels and performance are improved, but power delivery requirements and manufacturing costs increase

Engineering Contradiction:

Improveintegration levelVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The package substrate provides universal support for heterogeneous die integration through a unified structure that accommodates both through-bridge via connections for high-density signals and standard routing for power and ground. This multi-functional substrate design enables high integration levels for diverse die types while using established manufacturing processes, controlling costs despite the complexity of heterogeneous integration.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250273582A1Interconnections to package substrates for interconnect bridges

Publication Date: 2025.08.28 INTEL CORP

AI summary

Semiconductor package substrates and assemblies comprising semiconductor package substrates are provided. The semiconductor package substrates can include interconnect bridges having through-bridge vias. The semiconductor package substrates can also include collapsible cavities in dielectric layers. The interconnect bridges can include protruding conductive pads that form electrical connections with the semiconductor package substrate. Assemblies include semiconductor package substrates and semiconductor devices.