Semiconductor device and method of making an interconnect bridge with integrated passive devices
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Solution Overview
Problem
Semiconductor devices face challenges in interconnecting multiple semiconductor die within a system-in-package (SiP) module and finding sufficient footprint space for integrated passive devices.
Innovation Solution
The integration of an interconnect bridge with integrated passive devices (IPDs) is formed over a substrate using common semiconductor manufacturing steps, allowing IPDs to be easily integrated onto semiconductor die, reducing the need for external discrete passive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If discrete passive devices are used in SiP modules, then electrical functions are supported, but footprint space is insufficient
Solution Approach 1:
The patent merges passive devices (resistors, capacitors, inductors) with the interconnect bridge structure by forming them using the same semiconductor manufacturing processes on the same substrate. This integration eliminates the need for separate discrete passive devices, reducing footprint space while maintaining all necessary electrical functions.
Solution Approach 2:
The interconnect bridge is designed to serve multiple functions simultaneously: it provides electrical interconnection between semiconductor die and integrates passive devices for signal processing. This multi-functionality reduces the overall component count and footprint space required in the SiP module.
2Area of stationary object
If integrated passive devices are formed over semiconductor die, then footprint space is optimized, but manufacturing complexity increases
Solution Approach 1:
The patent combines the formation of passive devices with the existing interconnect bridge manufacturing process. Both are formed using the same semiconductor fabrication steps (deposition, etching, patterning) on the same substrate, eliminating the need for separate manufacturing processes and reducing overall manufacturing complexity.
3Adaptability or versatility
If multiple semiconductor die are interconnected, then system functionality is enhanced, but interconnection complexity increases
Solution Approach 1:
The interconnect bridge is designed as a multi-functional component that simultaneously provides mechanical support, electrical interconnection, and signal processing capabilities through integrated passive devices. This reduces the overall interconnection complexity by consolidating multiple functions into a single structure.
Data Source
AI summary
A semiconductor device has a first substrate. A first semiconductor die and second semiconductor die are disposed over the substrate. An interconnect bridge is disposed over the first semiconductor die and second semiconductor die. The interconnect bridge has a second substrate. A conductive trace is formed over the second substrate. The conductive trace is electrically coupled from the first semiconductor die to the second semiconductor die. An IPD is also formed over the second substrate. The IPD is electrically coupled between the first semiconductor die and second semiconductor die. An encapsulant is deposited over the first substrate, first semiconductor die, second semiconductor die, and interconnect bridge.