Interconnect Bridge Packaging for Shorter Die-to-Die Power Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Internal connection circuitry in semiconductor packages can interfere with power delivery conductors, leading to inefficiencies and other issues due to extended wire runs.
Innovation Solution
The use of an interconnect bridge with conductors configured to directly couple semiconductor dies through a redistribution layer, reducing the length of connections and minimizing interference with internal circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If internal connection circuitry is used to electrically connect multiple ICs in a package, then electrical connectivity between ICs is achieved, but the connection length increases and power delivery efficiency deteriorates
Solution Approach 1:
The patent transitions from planar routing of power delivery conductors to three-dimensional vertical routing through the interconnect bridge structure. Conductors are routed vertically through multiple layers and via holes, allowing power to bypass internal connection circuitry and reach ICs directly, thereby reducing connection length and energy loss while maintaining electrical connectivity
Solution Approach 2:
The interconnect bridge acts as an intermediary structure that provides direct vertical pathways for power delivery conductors. This bridge structure mediates between the external package connections and internal IC connections, enabling power to be delivered directly without passing through the internal connection circuitry that would otherwise extend the wire run and reduce efficiency
2Reliability
If power delivery conductors are routed through internal connection circuitry, then connectivity is established, but wire run length increases and causes efficiency reduction
Solution Approach 1:
The patent employs three-dimensional vertical routing through the interconnect bridge, using via holes and multiple conductor layers to create direct vertical pathways. This dimensional change allows power delivery conductors to bypass the extended horizontal wire runs through internal connection circuitry, significantly reducing the overall wire run length while maintaining connectivity
Solution Approach 2:
The interconnect bridge extracts the power delivery function from the internal connection circuitry pathway. By providing dedicated vertical pathways through the bridge structure, the power delivery conductors are separated from the signal routing functions, allowing direct and short connections to ICs without traversing the internal connection circuitry
Data Source
AI summary
Embodiments of the present disclosure include techniques for a package and process for semiconductor dies. An interconnect bridge includes first conductors that electrically connect two or more semiconductor die. The interconnect bridge includes second conductors between opposite surfaces. A substrate of the interconnect bridge is removed to expose conductors of an interconnect layer that are electrically coupled to connections to the first and second semiconductor dies in a region of overlap between the semiconductor dies and interface bridge.