Interconnect Cavity Slots for Vertical Contact Rises
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Solution Overview
Problem
Existing interconnect structures in wafer-level packaging face challenges when the cavity walls are vertical, as they require complex methods and are difficult to implement effectively.
Innovation Solution
The development of an interconnect device with a support featuring holes with closed contour walls and slots that communicate with the cavity, allowing conductive elements to pass through and connect conductive areas on either side of the support, while also providing electromagnetic protection by covering the cavity walls with conductive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact rises are formed on vertical cavity walls, then interconnect structures can be created, but the manufacturing process becomes complex and difficult to implement
Solution Approach 1:
The patent applies preliminary action by forming slots in the cavity walls before depositing the conductive material. This pre-prepared structure guides the conductive material deposition process, enabling contact rises to be formed on vertical walls without requiring complex subsequent manufacturing steps. The slots act as pre-formed templates that simplify the overall manufacturing process.
Solution Approach 2:
The slots formed in the cavity walls serve as intermediaries between the conductive material and the final contact rise structure. These slots guide and shape the conductive material during deposition, mediating the transformation from raw material to precisely formed contact rises on vertical surfaces, thereby simplifying the manufacturing process.
2Reliability
If slots are added to separate conductive elements, then electrical discontinuity is achieved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the slots: they serve both as separation barriers between conductive elements to ensure electrical discontinuity and as structural templates for guiding conductive material deposition. This combination of functions reduces overall device complexity by eliminating the need for separate components to achieve each function.
Solution Approach 2:
The slots exhibit multi-functionality by simultaneously providing electrical isolation between conductive elements and serving as molds for contact rise formation. This universal structure performs multiple critical functions within a single geometric feature, thereby reducing the overall complexity of the interconnect device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables easier and more efficient connection of elements on either side of the support, ensuring electrical discontinuity between conductive elements and providing protection against electromagnetic disruptions, thus improving the implementation of interconnect structures in microelectronics.
Implementation Method 1
performing a directional deposition of conducting material on said wall and on part of the slot
Implementation Method 2
The walls of the cavity can be covered with a conductive material. It is thus possible to form a protection against electromagnetic disruptions on the perimeter of the cavity
Data Source
AI summary
An interconnect device is disclosed including a support in which at least one hole is formed, the hole having walls forming a closed contour and being formed by a cavity and one or several slots communicating with the cavity. The slots extend in a direction making a non-zero angle with the main plane of the support. Several conducting elements are positioned on at least one wall of the hole and pass through the hole. The conducting elements are each intended to connect conducting areas to each other that are situated on either side of the support. At least one of the slots separates two of the conducting elements from each other.