Interconnect Conductor Void-Free Filling via Electrochemical Cycles

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Solution Overview

Problem

The formation of voids within conductive materials in interconnect members for integrated circuits and printed circuit boards leads to unsatisfactory performance, as existing methods fail to ensure complete filling of recesses without voids.

Innovation Solution

A method involving the application of alternating electric currents and ultrasonic waves with specific parameters to dissolve and deposit conductive materials, ensuring the recess remains open until completely filled, minimizing voids by controlling dissolution and deposition rates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional methods are used to fill conductive material into recesses, then the recess can be filled with conductive material, but voids are enclosed inside the trench and via leading to unsatisfactory performance

Engineering Contradiction:

Improvefilling completenessVSAvoidinterconnect performance

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies periodic dissolution and deposition cycles using alternating electric currents and ultrasonic waves. The conductive material is repeatedly dissolved and redeposited, with each cycle improving filling completeness while preventing void formation. This periodic action allows the recess to remain open during the process, ensuring complete filling without enclosed voids.

Inventive Principle:

Principle #19Periodic action

Solution Approach 2:

Ultrasonic waves are applied during both dissolution and deposition phases to mechanically vibrate the conductive material and electrolyte solution. This vibration prevents material aggregation and ensures uniform distribution, allowing the recess to stay open during filling while achieving complete penetration without voids.

Inventive Principle:

Principle #18Mechanical vibration

2Manufacturing precision

If electric current and ultrasonic wave are applied to dissolve and deposit conductive material, then the recess can be filled completely, but the process complexity increases

Engineering Contradiction:

Improvevoid eliminationVSAvoidprocess steps

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges dissolution and deposition operations into a single integrated process step. By applying both electric current and ultrasonic waves simultaneously during each cycle, and combining multiple cycles into one continuous process, the method achieves complete void elimination while reducing overall process complexity compared to separate sequential operations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electric current serves multiple functions: it drives both dissolution (anodic reaction) and deposition (cathodic reaction) phases. The ultrasonic wave also performs dual roles by enhancing both material removal and material deposition. This multi-functionality reduces the need for separate specialized process steps.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in conductors with minimal or no voids, achieving satisfactory performance as interconnect members by ensuring the recess is substantially free of voids, thereby enhancing the conductor's performance.

Implementation Method 1

applying a first electric current and a first ultrasonic wave for dissolving the first portion of the first conductive material set to obtain a first opening

Methodology Applied

Scientific EffectElectrochemical dissolution: Electrolysis

Implementation Method 2

applying a second electric current and a second ultrasonic wave for depositing a second conductive material set on the first conductive material set

Methodology Applied

Scientific EffectElectrochemical deposition: Electrodeposition

Implementation Method 3

applying a first electric current and a first ultrasonic wave for dissolving the first portion of the first conductive material set

Methodology Applied

Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Data Source

PatentUS9852943B2Method for manufacturing a conductor to be used as interconnect member

Publication Date: 2017.12.26 SEMICON MFG INT (SHANGHAI) CORP

AI summary

A method for manufacturing a conductor may include the following steps: preparing a substrate structure and a first metal set, wherein the substrate structure has a recess, wherein a first portion of the first metal set is positioned at the recess; applying a first electric current and a first ultrasonic wave for dissolving the first portion of the first metal set to obtain a first opening; applying a second electric current and a second ultrasonic wave for depositing a second metal set on the first metal set, wherein a first portion of the second metal set is positioned at a position of the first opening; applying a third electric current and a third ultrasonic wave for dissolving the first portion of the second metal set to obtain a second opening; and providing a third metal set through the second opening into the recess.