Serial Interconnect Control Windows for Link Width Transitions

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Solution Overview

Problem

Current interconnect architectures in high-performance computing systems face challenges in meeting the increasing demand for bandwidth and power efficiency, particularly in servers and mobile devices, where traditional interconnects struggle to balance performance with power consumption.

Innovation Solution

The development of a High Performance Interconnect (HPI) architecture that employs a layered protocol stack, including a transaction layer, link layer, and physical layer, with features such as credit-based flow control, virtual channels, and power management, to enable efficient data transfer and reduce power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional interconnect architectures are used to handle electrical communications, then device complexity is reduced, but bandwidth and power efficiency deteriorate

Engineering Contradiction:
ImprovebandwidthVSAvoidinterconnect architecture complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The interconnect architecture is segmented into multiple independent serial lanes instead of using a single parallel electrical bus. Each lane operates independently at high speed, allowing bandwidth to scale by adding more lanes without increasing the complexity of individual lane operations. This segmentation enables the system to achieve high throughput while maintaining manageable complexity at the lane level.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces traditional parallel electrical communication mechanisms with serial communication mechanisms. This substitution allows for higher bandwidth through differential signaling and advanced encoding schemes while reducing power consumption and signal integrity issues associated with parallel electrical buses at high frequencies.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If the number of processing devices is increased to enhance computing power, then processing capability is improved, but communication overhead and power consumption worsen

Engineering Contradiction:
Improveprocessing capabilityVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSUse of energy by stationary object

Solution Approach 1:

The interconnect employs periodic clocking and structured data transmission patterns that allow for efficient power management. By using periodic actions in data transmission and clocking schemes, the system can synchronize multiple processing devices effectively while minimizing idle power consumption and enabling sleep states during low-activity periods.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The patent utilizes advanced encoding schemes and differential signaling parameters that improve signal integrity and reduce power consumption per bit transmitted. By optimizing transmission parameters such as voltage levels, clock frequencies, and encoding formats, the system achieves high-speed communication between multiple processing devices with reduced power overhead compared to traditional approaches.

Inventive Principle:
Principle #35Parameter changes

3Speed

If higher transmission rates are demanded to meet future processor requirements, then data transfer speed is improved, but signal integrity and power efficiency worsen

Engineering Contradiction:
Improvedata transfer speedVSAvoidpower efficiency
Core Design Contradiction:
SpeedVSLoss of energy

Solution Approach 1:

The patent replaces traditional single-ended electrical signaling with differential signaling mechanisms. This substitution enables higher data transfer speeds by providing better noise immunity and signal integrity at high frequencies, while the balanced nature of differential pairs reduces electromagnetic radiation and power consumption compared to unbalanced single-ended signals at equivalent speeds.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS9355058B2High performance interconnect physical layer
Publication Date: 2016.05.31 INTEL CORP
  • US9355058B2 patent drawing
  • US9355058B2 patent drawing
  • US9355058B2 patent drawing

AI summary

A periodic control window is embedded in a link layer data stream to be sent over a serial data link, where the control window is configured to provide physical layer information including information for use in initiating state transitions on the data link. The link layer data can be sent during a link transmitting state of the data link and the control window can interrupt the sending of flits. In one aspect, the information includes link width transition data indicating an attempt to change the number of active lanes on the link.