Interconnect Die Packaging Without Interposers or TSVs

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Solution Overview

Problem

The increasing complexity of integrated circuit packages requires more efficient interconnection methods that can eliminate the need for costly interposers and allow for high-density connections without through-silicon vias.

Innovation Solution

The use of interconnect dies with redistribution lines and through-vias to connect device dies and package components, forming high-density interconnections without the need for interposers, using processes similar to those for forming semiconductor wafers and dies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If interposers with through-silicon vias are used to interconnect device dies, then high-density interconnections and advanced package functionality are achieved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improveinterconnection densityVSAvoidpackage structure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the interposer component from the package structure. Instead of using a separate interposer substrate with through-silicon vias, the invention directly bonds device dies to the package substrate, removing the intermediate interconnection layer and simplifying the overall package architecture while maintaining interconnection functionality

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the functions of the interposer and package substrate into a single integrated structure. The package substrate directly provides both mechanical support and electrical interconnection pathways, combining the structural and interconnection roles that were previously separated between interposer and substrate components

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If more device dies are packaged in the same package to achieve more functions, then package functionality increases, but package complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvepackage functionalityVSAvoidmanufacturing ease

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent segments the package into modular device dies that can be independently manufactured and then bonded to the package substrate. This segmentation allows each die to be optimized and manufactured separately using standard processes, then assembled into the final multi-functional package, improving manufacturability while maintaining functional versatility

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The package substrate is designed with universal interconnection capabilities that can accommodate multiple different device dies with various functions. The substrate provides a common platform with standardized bonding interfaces and redistribution pathways that work with diverse die types, enabling multi-functional packages without requiring specialized manufacturing processes for each configuration

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS11978714B2Encapsulated package including device dies connected via interconnect die

Publication Date: 2024.05.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes bonding a first device die and a second device die to an interconnect die. The interconnect die includes a first portion over and bonded to the first device die, and a second portion over and bonded to the second device die. The interconnect die electrically connects the first device die to the second device die. The method further includes encapsulating the interconnect die in an encapsulating material, and forming a plurality of redistribution lines over the interconnect die.