Interconnect Hole Test Structure for Alignment Detection
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Solution Overview
Problem
Current electrical test structures for semiconductor manufacturing, such as kelvin four-terminal and chain test structures, are inadequate in monitoring the alignment of interconnect holes, which is crucial for ensuring proper connectivity and manufacturing efficiency.
Innovation Solution
An electrical test structure comprising a first layer, an interconnect hole, and a second layer, where the alignment of the interconnect hole is determined by detecting current flow based on offset distances relative to a preset position, forming a conductive path when misaligned and not forming a path when aligned, facilitating reliable detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional WAT structures are used for manufacturing process testing, then manufacturing process inspection can be performed, but alignment monitoring of interconnect holes cannot be achieved
Solution Approach 1:
The second layer is segmented into a body part and a test part, where the test part specifically interacts with the interconnect hole to enable alignment monitoring. This segmentation allows the test structure to perform alignment monitoring without requiring complete redesign of the entire test structure.
Solution Approach 2:
The test part acts as an intermediary element between the interconnect hole and the measurement system. It provides a controlled interface that enables alignment monitoring through current detection while maintaining compatibility with conventional WAT testing approaches.
2Measurement precision
If alignment detection capability is added to test structures, then interconnect hole alignment can be monitored, but the test structure becomes more complex
Solution Approach 1:
The test part is designed with specific local properties that enable alignment detection. By concentrating the alignment-sensitive features in the test part rather than distributing them throughout the entire structure, the patent achieves alignment monitoring capability with minimal increase in overall complexity.
Solution Approach 2:
The test structure maintains compatibility with conventional WAT testing while adding alignment monitoring capability. The same basic structure serves both traditional manufacturing process testing and interconnect hole alignment monitoring, making the additional functionality relatively simple to implement.
3Productivity
If simple test structures are used, then manufacturing efficiency is maintained, but alignment detection of interconnect holes is not possible
Solution Approach 1:
The interconnect hole itself serves as part of the alignment detection mechanism. By designing the test part to interact directly with the interconnect hole, the structure uses the interconnect hole's own position and geometry to provide alignment information, eliminating the need for separate complex measurement systems.
Solution Approach 2:
The patent detects alignment by monitoring changes in electrical parameters (current flow) rather than requiring direct mechanical or optical measurement. This parameter change approach allows alignment detection to be performed using existing electrical test infrastructure, maintaining manufacturing efficiency while adding measurement capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for simple and reliable alignment detection of interconnect holes, improving manufacturing efficiency and product yield by ensuring accurate alignment without complex structural modifications.
Implementation Method 1
when the offset distance of the interconnect hole relative to a preset position in a second direction is greater than or equal to a first preset distance, and/or an offset distance of the interconnect hole relative to the preset position in a third direction is greater than or equal to a second preset distance, the interconnect hole is in contact with the test part
Data Source
AI summary
The present disclosure provides an electrical test structure, a semiconductor structure and an electrical test method. In the electrical test structure, in a first direction, the electrical test structure includes a first layer, an interconnect hole and a second layer arranged in a stack, and the interconnect hole is in contact with the first layer; the second layer includes a body part and a test part, and the test part is connected to the body part; the interconnect hole is configured as, when an offset distance of the interconnect hole relative to a preset position in a second direction is less than a first preset distance, or an offset distance of the interconnect hole relative to the preset position in a third direction is less than a second preset distance, the interconnect hole is spaced apart from the test part.