Interconnect Device with Inline Components for Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in electronic devices is the limited space on printed circuit boards (PCBs) for placing passive components close to Ball Grid Array (BGA) devices, which leads to issues with impedance matching and signal integrity due to the need for extra vias and signal traces, causing spurious noise and performance degradation.
Innovation Solution
An interconnect device with wells that house two-terminal components, allowing them to be positioned inline with solder balls and pads, freeing up PCB space and reducing the need for vias and signal traces, using spring-loaded or press-fit mechanisms for secure connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If surface mount passive components are placed on the PCB near BGA devices, then impedance matching and signal integrity can be improved, but PCB surface area is consumed and device placement becomes challenging
Solution Approach 1:
The patent moves the passive component from the PCB surface (2D plane) to the vertical dimension by placing it within the BGA package cavity. This dimensional transition allows the component to be positioned near the signal source without consuming valuable PCB surface area, as the component resides in the third dimension (height) rather than competing for planar space on the board.
Solution Approach 2:
The passive component is nested within the BGA package structure, specifically positioned in the cavity between the BGA device and the PCB. This nesting approach allows the component to be housed inside the existing package footprint, utilizing the vertical space within the package rather than requiring additional external space on the PCB.
2Reliability
If vias and signal traces are used to connect surface mount components to BGA devices, then electrical connections can be established, but extra stub length adds inductance and causes spurious noise
Solution Approach 1:
The patent extracts the passive component from the traditional PCB mounting location and relocates it directly into the BGA package cavity. This extraction eliminates the need for separate via and trace connections between the component and the BGA device, as the component is now positioned immediately adjacent to the signal source, removing the intermediate connection structures that caused inductance and noise.
Solution Approach 2:
The patent merges the passive component placement with the BGA package structure itself. Instead of being separate entities connected by vias and traces, the component is integrated within the package cavity, creating a unified structure where the component is inherently connected to the signal source without requiring additional interconnection elements.
3Reliability
If passive components are placed close to BGA solder balls, then terminating devices can be located near the signal source, but limited space makes optimal component placement challenging
Solution Approach 1:
The patent resolves the space constraint by transitioning from 2D PCB surface placement to 3D placement within the package cavity. This dimensional change provides adequate space for optimal component placement near the solder balls without the crowding issues that exist on the limited PCB surface area, allowing engineers to position components precisely where needed for optimal impedance matching.
Data Source
AI summary
An interconnect device is provided with a body through which a plurality of wells has been defined. At least one component having two terminals is provided in one or more of the wells. The component is sealed in its respective well such that the two terminals are accessible on opposite sides of the body. The body corresponds to a Ball Grid Array (BGA) device and is positioned between a BGA device and a printed circuit board (PCB). The component in the well is then inline with a solder ball on the BGA device and a corresponding pad on the PCB. Providing the component in the well frees up surface area on the PCB and also allows for positioning the component closer to a source of a signal. A component in the well is a discrete component having two terminals that may be solderable or made from a conductive pliable material. The terminals may be spring-mounted on the component.