Interconnect Interposer for Magnetic Slider Bond Pads
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Solution Overview
Problem
The reduction in size of magnetic recording sliders to minimize head-media separation complicates the electrical interconnect strategy, particularly with the increasing number of components requiring additional bond pads at the trailing edge, which is challenging due to the limitations of current techniques like laser solder jetting that require bond pads to be in close proximity to the TGA contacts.
Innovation Solution
The use of an interconnect interposer with a back side comprising electrical contacts that connect with the bond pads on the slider's trailing edge and a front side with corresponding interposer pads, allowing for the spreading out of bond pads and simplifying the connection strategy by using standard IC technology, such as laser solder jetting, while accommodating a greater number of bond pads without increasing the size of the slider.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the slider size is reduced to minimize head-media separation, then the head-media separation is minimized, but the electrical interconnect strategy becomes more complex and difficult to implement
Solution Approach 1:
The patent introduces an interposer layer that adds a dimensional element between the slider and TGA, allowing bond pads to be positioned on the interposer rather than directly on the slider trailing edge. This dimensional addition enables electrical interconnects to be routed through the interposer, simplifying the overall interconnect strategy while maintaining reduced slider size.
Solution Approach 2:
The interposer acts as an intermediary component between the slider and TGA, providing a platform for bond pads that are spaced apart in a regular pattern. This intermediary structure facilitates electrical connections without requiring bond pads to be in close proximity to TGA contacts, thereby simplifying the interconnect approach.
2Quantity of substance
If additional bond pads are added to accommodate increasing number of components, then the electrical connectivity is improved, but the bond pads cannot be placed in close proximity to TGA contacts due to slider size constraints
Solution Approach 1:
By introducing the interposer as an additional dimensional layer, the patent enables bond pads to be positioned on the interposer surface rather than on the slider trailing edge. This allows multiple bond pads to be spaced apart in a regular pattern while still maintaining electrical connectivity, as the interposer provides the necessary spatial arrangement.
Solution Approach 2:
The patent segments the electrical interconnect function into two parts: the interposer carries the bond pads in a spaced-apart regular pattern, while the TGA provides the connection to the slider. This segmentation allows bond pads to be easily positioned in a regular pattern on the interposer without requiring close proximity to TGA contacts.
3Manufacturing precision
If bond pads are positioned in a regular spaced-apart pattern on the interposer, then the manufacturing precision is improved, but the physical distance between bond pads and TGA contacts increases
Solution Approach 1:
The interposer introduces an additional dimensional layer that allows bond pads to be positioned in a regular spaced-apart pattern on the interposer surface. This dimensional addition enables manufacturing precision to be improved through regular patterning, while the interposer itself bridges the gap to TGA contacts, making the increased physical distance acceptable.
Data Source
AI summary
A slider of a magnetic recording head comprises a media-facing surface, an upper surface opposing the media-facing surface, a leading edge, and a trailing edge. A plurality of electrical bond pads is disposed in a spaced-apart relationship on the trailing edge of the slider. An interconnect interposer is connected to the trailing edge of the slider. The interposer comprises a back side comprising a plurality of electrical contacts in contact with the plurality of bond pads on the trailing edge of the slider. The interposer also comprises a front side comprising a plurality of electrical interposer pads corresponding in number to the plurality of electrical contacts on the back side. The interposer further comprises a plurality of conductors each of which electrically couples one of the plurality of electrical contacts on the back side with one of the plurality of interposer pads on the front side.