Interconnect Package Structure Without Wire Bonding for Power Modules

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional power module packaging using wire bonding and silicone gel filler material experiences degradation over time, leading to reduced reliability due to moisture and oxidation issues, which affects the insulation and interconnection performance.

Innovation Solution

An interconnect package is developed using multiple layers of insulating film with source and gate connecting portions, where the second insulating layer has openings for exposing conductive traces, and a sintering process is used to attach the package to the substrate, eliminating the need for wire bonding and enhancing reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wire bonding and silicone gel filler material are used for packaging, then interconnection and packaging can be achieved, but reliability degrades over time due to moisture and oxidation

Engineering Contradiction:

Improveinterconnection reliabilityVSAvoidservice life

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The invention extracts and eliminates the silicone gel filler material from the packaging structure, replacing it with an insulating layer configuration that provides both insulation and protection without the aging issues of gel materials. This removal of the harmful filler material directly addresses the reliability degradation problem over time.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention uses composite material structures including multiple insulating layers (first insulating layer, second insulating layer) combined with conductive materials (source connecting portion, gate connecting portion) to create a packaging structure that provides both mechanical support and environmental protection without relying on aging-prone silicone gel.

Inventive Principle:

Principle #40Composite materials

2Reliability

If conventional wire bonding is used, then electrical connection can be established, but wire defects occur leading to performance degradation

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidwire defects

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention replaces the mechanical wire bonding system with a direct structural integration approach where conductive portions are formed as integral parts of the packaging structure, eliminating the need for separate wire bonding operations and the associated defects.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The conductive connecting portions are formed in advance during the packaging process rather than through subsequent wire bonding, ensuring proper positioning and connection before the device is subjected to operational stress, thereby preventing wire defects.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If filler material is used for packaging, then insulation can be provided, but moisture prevention and oxidation prevention degrade with aging

Engineering Contradiction:

Improveinsulation performanceVSAvoidprotection duration

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The invention changes the material parameters from aging-prone silicone gel to stable insulating layer materials that maintain their moisture and oxidation prevention properties over extended periods, thereby improving long-term protection duration without sacrificing insulation performance.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly improves the reliability of power modules by preventing wire defects and maintaining performance during thermal cycling, ensuring stable electrical connections and insulation.

Implementation Method 1

a sintering process is used to attach the package to the substrate

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentUS20250006633A1Interconnect package, method of forming the same and power module

Publication Date: 2025.01.02 SHENZHEN STS MICROELECTRONICS CO LTD

AI summary

Embodiments of the present disclosure relate to an interconnect package, a method of forming the interconnect package, and a power module. The interconnect package includes a first insulating layer, a source connecting portion disposed on a surface of the first insulating layer and adapted to electrically connect a source pad to a substrate, a second insulating layer, and a gate connecting portion disposed between the first insulating layer and the second insulating layer and adapted to electrically connect a gate pad to the substrate. In addition, the second insulating layer has a plurality of gate openings and a plurality of source openings running therethrough and wherein a first surface of the second insulating layer is configured to attach to a surface of the first insulating layer such that a plurality of portions of the source connecting portion are exposed from the plurality of source openings on a second surface of the second insulating layer opposite the first surface, and such that a plurality of portions of the gate connecting portion are exposed from the plurality of gate openings on the second surface of the second insulating layer.