Interconnect Paths for Electrical Assembly Fault Localization
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Solution Overview
Problem
Current test systems for electrical assemblies face challenges in efficiently testing and characterizing the increasing number of interposer connections and solder joints due to limited test nodes and hardware, making it difficult to identify and locate fault points effectively.
Innovation Solution
A test system with interconnect paths that electrically connect individual paths, allowing for increased data yield and fault localization without significantly increasing the number of test nodes or hardware, by using a daisy chain package and interconnect paths to create a matrix of linear equations and solve for segment resistances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of test nodes is increased to test more interposer connections and solder joints, then the measurement precision and fault localization capability improve, but the device complexity and equipment cost increase
Solution Approach 1:
The patent divides the electrical assembly into multiple electrical paths, each consisting of segments that can be individually analyzed. By segmenting the test structure into manageable paths and segments, the system can localize faults to specific segments without requiring a proportional increase in test nodes. Each segment's electrical characteristics can be independently measured and analyzed to identify degradation or failures.
Solution Approach 2:
The patent introduces interconnect paths that electrically connect individual electrical paths, creating a multi-dimensional test network. This additional dimensional connectivity allows the system to infer segment characteristics through multiple measurement pathways, enabling fault localization without directly increasing the number of physical test nodes. The interconnect paths create alternative measurement routes that provide redundant information for segment characterization.
2Adaptability or versatility
If the number of interposer connections and solder joints is increased to support more contact points, then the adaptability and functionality improve, but the difficulty of detecting and measuring faults increases
Solution Approach 1:
The patent segments the large number of interposer connections and solder joints into discrete electrical path segments. Each segment represents a manageable portion of the overall interconnect structure, allowing faults to be localized to specific segments rather than searching through all connections. This segmentation transforms an overwhelming measurement problem into a series of manageable segment-level measurements.
Solution Approach 2:
The patent creates interconnect paths that provide additional measurement dimensions by electrically connecting individual electrical paths. These interconnect paths enable cross-path measurements that provide redundant information about segment characteristics, making fault detection more reliable without requiring a direct increase in test nodes proportional to the number of interposer connections.
3Measurement precision
If the number of test paths is increased to test all interposer interface connections, then the measurement precision improves, but the device complexity and hardware requirements increase
Solution Approach 1:
The patent merges multiple electrical paths through interconnect paths that electrically connect individual paths. This merging creates a network where measurements taken on one path provide information about connected paths, reducing the total number of independent measurements required. The interconnect paths allow the system to combine measurement data from multiple paths to infer segment characteristics that would otherwise require separate direct measurements.
Solution Approach 2:
The interconnect paths serve multiple functions: they electrically connect individual electrical paths, provide alternative measurement routes, enable cross-path measurements, and facilitate segment characterization through redundant measurement pathways. This multi-functionality allows the same hardware infrastructure to support comprehensive testing of all interposer connections without proportionally increasing hardware requirements.
Data Source
AI summary
A test system including a package with interconnect paths. The package may have electrical paths that are electrically connected by the interconnect paths. The electrically connected electrical paths may yield increased data without significantly increasing the required testing hardware.