Interconnect Receptacle Cooling With Bottom-Side Heat Dissipation
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Solution Overview
Problem
Conventional cooling systems for high-capability computing components like transceivers generate thermal gradients, leading to mechanical stress, signal degradation, and reduced reliability due to inefficient heat dissipation, particularly when only cooling from one side.
Innovation Solution
Implementing a thermal dissipation device on the bottom surface of receptacle assemblies, utilizing conductive and dissipation elements to dissipate heat from both sides, reducing thermal gradients and enhancing heat extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional one-sided cooling systems are used for transceivers, then the cooling system structure is simple, but thermal gradients occur leading to mechanical stress and signal degradation
Solution Approach 1:
The patent transitions from one-sided cooling to two-sided cooling by utilizing the bottom surface of the receptacle assembly for heat dissipation. This dimensional expansion allows heat to be removed from both the top and bottom surfaces of the transceiver, eliminating thermal gradients and improving reliability without requiring a fundamentally new cooling approach
Solution Approach 2:
The bottom surface of the receptacle assembly, which traditionally served only as a mounting surface, is repurposed to provide thermal dissipation functionality. By integrating heat dissipation features into the existing bottom surface structure, the system achieves multi-functionality without significantly increasing overall device complexity
2Power
If high-capability computing components are used, then processing power increases, but heat generation increases leading to thermal management challenges
Solution Approach 1:
The patent addresses thermal management by utilizing the bottom surface area for heat dissipation, effectively doubling the available cooling surface area. This dimensional approach allows high-power components to be cooled from both top and bottom surfaces, maintaining processing power while controlling temperatures
3Reliability
If thermal dissipation device is integrated into the bottom surface space, then additional cooling space is eliminated, but heat dissipation effectiveness is improved
Solution Approach 1:
The patent merges the thermal dissipation device with the bottom surface structure of the receptacle assembly. By integrating the cooling features into the existing bottom surface rather than adding separate cooling components, the system achieves effective heat dissipation without significantly increasing structural complexity
Solution Approach 2:
The bottom surface is designed to serve dual purposes: structural support/mounting and thermal dissipation. This multi-functional design eliminates the need for separate dedicated cooling structures, maintaining device simplicity while improving thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach maintains safe operating temperatures, reduces mechanical stress, and improves signal quality by effectively dissipating heat from both sides of transceivers, extending their lifespan and maintaining high-performance computing integrity.
Implementation Method 1
the thermal dissipation device is configured to dissipate heat from the receptacle assembly to an external environment via the bottom surface
Implementation Method 2
the at least one dissipation element is a heat pipe
Data Source
AI summary
Assemblies, systems, and methods are provided for dissipating heat from a receptacle assembly for holding a transceiver and attaching to a PCB. The receptacle assembly has a body defining a first end, a second end, a top surface extending between the first end and the second end, and a bottom surface extending between the first end and the second end opposite the top surface. A thermal dissipation device is disposed on the bottom surface, and the thermal dissipation device is configured to dissipate heat from the receptacle assembly to an external environment via the bottom surface. The thermal dissipation device may include at least one conductive element and at least one dissipation element and may interact with other cooling features of the PCB.