Interconnect Layer Resin Selection via Substrate Removal
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Solution Overview
Problem
The existing manufacturing methods for electronic devices restrict the selection of resins for interconnect layers due to thermal decomposition temperature limitations, leading to increased costs and limited options for achieving fine connections between interconnect layers and electronic components.
Innovation Solution
The method involves forming a first interconnect layer on a supporting substrate, removing it to expose a conductive plug, and then forming a second interconnect layer, allowing the use of a resin with a lower thermal decomposition temperature for the second layer while maintaining a resin suitable for microprocessing for the first layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the supporting substrate is removed before forming the second interconnect layer, then a resin with lower thermal decomposition temperature can be used for the second interconnect layer, but the manufacturing process becomes more complex
Solution Approach 1:
The manufacturing process is segmented into distinct stages: first forming the first interconnect layer on the supporting substrate, then removing the supporting substrate, and finally forming the second interconnect layer. This segmentation allows each stage to use materials and processes optimized for that specific stage, enabling the use of low-temperature resin for the second layer without constraining the first layer formation.
Solution Approach 2:
The first interconnect layer is formed in advance on the supporting substrate before the substrate is removed. This preliminary action ensures that the first interconnect layer is properly established and can serve as a stable base for subsequent operations, while allowing the supporting substrate to be removed later when it is no longer needed for structural support.
2Manufacturing precision
If a resin appropriate for micro processing is used for the first interconnect layer, then fine connection with electronic component is achieved, but the manufacturing cost increases
Solution Approach 1:
Different resin materials are used for different interconnect layers based on their specific requirements. The first interconnect layer, which requires fine connection precision, uses a resin appropriate for micro processing. The second interconnect layer, which does not require the same level of precision, uses a relatively inexpensive resin. This local differentiation of material quality optimizes both performance and cost.
Data Source
AI summary
The electronic device includes a first interconnect layer and a second interconnect layer. The second interconnect layer is provided on the lower surface of the first interconnect layer. The first interconnect layer includes a via plug (first conductive plug). An end face of the via plug on the side of the second interconnect layer is smaller in area than the opposite end face. The via plug is exposed on the surface of the first interconnect layer facing the second interconnect layer. An insulating resin forming the first interconnect layer is higher in thermal decomposition temperature than an insulating resin forming the second interconnect layer.