Interconnect Shield Structure for Signal Integrity
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Solution Overview
Problem
Integrated devices face challenges in minimizing cross-talk between interconnects, which affects signal integrity due to the lack of effective shielding in existing interconnect structures.
Innovation Solution
The implementation of an interconnect structure comprising an inner interconnect, a dielectric layer, and an outer conductive layer, where the outer conductive layer acts as a shield to reduce electromagnetic interference and cross-talk, thereby enhancing signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional interconnect structures are used, then device complexity is reduced, but cross-talk between interconnects increases and signal integrity deteriorates
Solution Approach 1:
The interconnect structure is segmented into distinct functional layers: an inner conductive interconnect core, a dielectric layer, and an outer conductive shield layer. This segmentation allows each layer to perform its specific function independently, with the inner layer carrying signals and the outer layer providing electromagnetic shielding, thereby improving signal integrity while maintaining manageable complexity through modular design
Solution Approach 2:
The patent implements a nested structure where the inner conductive interconnect is positioned within a dielectric layer, which is in turn surrounded by an outer conductive shield layer. This nested configuration allows the signal-carrying inner interconnect to be protected by the outer shield, reducing cross-talk and electromagnetic interference while maintaining a compact overall structure
2Reliability
If outer conductive shield layer is added, then cross-talk reduction is achieved, but manufacturing complexity increases
Solution Approach 1:
The dielectric layer is formed first as a preliminary step, creating a prepared substrate before the inner conductive interconnect is deposited. This preliminary action establishes the structural foundation and electrical isolation necessary for subsequent layers, making the overall manufacturing process more systematic and controllable
Solution Approach 2:
The patent transitions from planar interconnect designs to a three-dimensional layered structure by adding vertical dimensionality with multiple conductive and dielectric layers stacked together. This dimensional change enables the outer shield layer to effectively surround and protect inner interconnects, providing superior isolation while the layer-by-layer fabrication approach maintains manufacturing feasibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces cross-talk between signals traveling through interconnects, improving signal integrity and providing improved isolation, especially when multiple interconnect structures with outer conductive layers are used.
Implementation Method 1
The outer conductive layer is configured to operate as a shield for the inner interconnect
Data Source
AI summary
An integrated device that includes a substrate, an interconnect portion and an interconnect structure. The interconnect portion is located over the substrate. The interconnect portion includes a plurality of interconnects and at least one dielectric layer. The interconnect structure is located over the interconnect portion. The interconnect structure includes an inner interconnect, a dielectric layer coupled to the inner interconnect, and an outer conductive layer coupled to the dielectric layer. The outer conductive layer is configured to operate as a shield for the inner interconnect.