Interconnect Structures for Preventing Solder Bridging
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Solution Overview
Problem
Conventional methods for inhibiting solder bridging between stacked semiconductor dies during the reflow process either increase manufacturing complexity and cost or are inefficient in preventing electrical shorts, as they either relax pillar pitch or redesign bond pads.
Innovation Solution
The implementation of interconnect structures with laterally offset solder material placement and a containment layer to prevent solder bridging, where the solder material is disposed on a portion of the interconnect structure laterally offset from the contact, reducing the likelihood of electrical shorts and increasing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder material is placed directly over contacts, then electrical connection is achieved, but solder bridging occurs between adjacent pillars
Solution Approach 1:
The solder material is laterally offset from the contact in the planar direction while maintaining vertical alignment through the interconnect structure. This dimensional shift in the lateral plane prevents solder bridging between adjacent pillars while preserving electrical connection through the contact via the interconnect structure.
Solution Approach 2:
The interconnect structure acts as an intermediary element between the contact and the solder material. It provides a lateral extension that allows the solder to connect to the contact indirectly through the interconnect structure, preventing direct solder bridging between adjacent contacts while maintaining electrical connectivity.
2Object-affected harmful factors
If pillar pitch is relaxed to prevent solder bridging, then solder bridging is reduced, but device volume increases
Solution Approach 1:
Instead of increasing pitch in the lateral direction, the solution shifts the solder placement to a different dimensional arrangement - laterally offset but vertically aligned through the interconnect structure. This maintains compact lateral pitch while preventing solder bridging through the dimensional reconfiguration.
Solution Approach 2:
The interconnect structure segments the electrical connection path into distinct lateral and vertical components. The lateral offset portion prevents solder bridging, while the vertical portion through the contact maintains electrical connectivity, allowing compact pitch without sacrificing connection reliability.
3Object-affected harmful factors
If redistribution layer is formed to relax pillar pitch, then solder bridging is prevented, but manufacturing complexity increases
Solution Approach 1:
The interconnect structure merges the functions of lateral offset and vertical connection into a single integrated structure. This eliminates the need for separate redistribution layers while achieving both solder bridging prevention and electrical connectivity through the combined lateral and vertical portions.
Solution Approach 2:
The interconnect structure serves multiple functions simultaneously: it provides lateral offset to prevent solder bridging, maintains vertical electrical connection through the contact, and enables compact pitch arrangement. This multi-functionality replaces the need for additional redistribution layer structures.
Data Source
AI summary
Semiconductor dies having interconnect structures formed thereon, and associated systems and methods, are disclosed herein. In one embodiment, an interconnect structure includes a conductive material electrically coupled to an electrically conductive contact of a semiconductor die. The conductive material includes a first portion vertically aligned with the conductive contact, and a second portion that extends laterally away from the conductive contact. A solder material is disposed on the second portion of the interconnect structure such that the solder material is at least partially laterally offset from the conductive contact of the semiconductor die. In some embodiments, an interconnect structure can further include a containment layer that prevents wicking or other undesirable movement of the solder material during a reflow process.