Optoelectronic Interconnect with Internal Stress Relief Slots
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Solution Overview
Problem
Laminated photovoltaic systems face challenges in thermal management and stress relief due to the large coefficient of thermal expansion and rapid stiffness increase of encapsulants at low temperatures, leading to thermal stress and potential failure of components like bypass diodes.
Innovation Solution
The design of interconnects with stress relief features such as T-shaped slots, L-shaped extensions, and narrow slots that allow for flexibility and reduced stress on components, along with enhanced thermal coupling to heat sinks, addresses the thermal expansion mismatch and stress issues by enabling motion and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If encapsulants are used in photovoltaic systems, then thermal management is improved, but thermal stress increases due to large coefficient of thermal expansion and rapid stiffness increase at low temperatures
Solution Approach 1:
The interconnect is divided into multiple segments with stress relief features including T-shaped slots, L-shaped extensions, and narrow slots. These segmentation features allow the interconnect body to flex and accommodate thermal expansion differences between the encapsulant and other components, reducing thermal stress while maintaining thermal management capabilities.
Solution Approach 2:
The interconnect design incorporates features that change its mechanical parameters (flexibility, stress distribution) in response to temperature changes. The stress relief features enable the interconnect to adapt its stiffness and shape parameters dynamically through thermal cycles, accommodating the rapid stiffness increase of encapsulants at low temperatures without generating excessive thermal stress.
2Reliability
If interconnects with stress relief features are used, then stress on components is reduced, but manufacturing complexity increases
Solution Approach 1:
The stress relief features (T-shaped slots, L-shaped extensions, narrow slots) are designed as integrated segmentation elements that can be fabricated in a single stamping or forming operation. This segmentation approach reduces stress on components while minimizing manufacturing complexity by creating all features simultaneously rather than through multiple assembly steps.
Solution Approach 2:
The interconnect utilizes composite material properties by combining a metallic base material with laser-formed stress relief features. This composite approach allows the interconnect to exhibit both structural integrity and stress relief capabilities, reducing component stress while maintaining ease of manufacture through a single-material construction process.
3Loss of energy
If thermal coupling to heat sinks is enhanced, then heat dissipation is improved, but thermal resistance increases due to interface contact issues
Solution Approach 1:
The interconnect design incorporates dynamic stress relief features that adapt to thermal expansion and contraction cycles. The T-shaped slots and L-shaped extensions allow the interconnect to maintain optimal contact pressure with heat sinks across varying temperatures, enhancing heat dissipation while compensating for interface contact issues that would otherwise increase thermal resistance.
Solution Approach 2:
The stress relief features are specifically designed to utilize thermal expansion principles, allowing the interconnect body to expand and contract with temperature changes while maintaining consistent thermal contact with heat sinks. This accommodates the large coefficient of thermal expansion of encapsulants and prevents interface separation that would increase thermal resistance, thereby improving heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed interconnect design reduces stress on components, minimizes thermal resistance, and enhances the reliability of photovoltaic systems by accommodating thermal expansion and maintaining efficient electrical current flow, thereby preventing thermal failure and improving system performance.
Implementation Method 1
the large coefficient of thermal expansion and rapid stiffness increase of encapsulants at low temperatures, leading to thermal stress
Implementation Method 2
enhanced thermal coupling to heat sinks, addresses the thermal expansion mismatch and stress issues by enabling motion and heat dissipation
Data Source
AI summary
Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body, between the first and second ends. A stress relief feature is disposed in the interconnect body. The stress relief feature includes a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body.