Interconnect Substrate With Conductive Pillars for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing demand for high-performance and miniaturized electronic devices, particularly in automotive and IoT applications, necessitates more compact and reliable integrated circuit packaging solutions that current technologies, such as Molded Interconnect Substrate (MIS), struggle to meet due to limitations in thermal-mechanical compatibility and reliability.
Innovation Solution
The development of an interconnect substrate with conductive pillars built using processes like electrolytic or electroless plating, which are electrically coupled to conductive structures or layers, and covered with a molding compound, providing enhanced thermal and electrical connectivity while allowing for miniaturization and increased functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional Molded Interconnect Substrate (MIS) is used, then basic packaging functionality is achieved, but thermal-mechanical compatibility and reliability are insufficient for high-performance applications
Solution Approach 1:
The patent changes the physical and chemical parameters of the substrate by incorporating conductive pillars with specific materials (copper, aluminum, or alloys) and controlled dimensions (5-50 micrometers in diameter, 50-500 micrometers in height). These parameter modifications enable the substrate to achieve superior thermal-mechanical compatibility and electrical conductivity, resolving the contradiction between basic packaging functionality and high-performance application requirements
Solution Approach 2:
The patent creates a composite structure by integrating conductive pillars made of copper, aluminum, or their alloys into the substrate matrix. This composite approach combines the mechanical properties of the substrate material with the excellent thermal and electrical conductivity of the metal pillars, achieving both structural integrity and enhanced thermal-mechanical compatibility for high-performance applications
2Volume of moving object
If device size is reduced for miniaturization, then form factor is improved, but thermal management and electrical connectivity become more challenging
Solution Approach 1:
The patent transitions from planar two-dimensional interconnect structures to three-dimensional vertical structures by implementing conductive pillars extending through the substrate thickness. This dimensional change enables efficient thermal and electrical conduction paths in the vertical direction, allowing compact package design while maintaining effective heat dissipation and electrical connectivity
Solution Approach 2:
The patent segments the thermal and electrical conduction function into discrete conductive pillar elements distributed throughout the substrate. Each pillar acts as an independent thermal and electrical conduit, enabling scalable thermal management in miniaturized packages where the number and distribution of pillars can be optimized for specific heat dissipation requirements
3Reliability
If conductive pillars are built up using electrolytic or electroless plating, then electrical connectivity and thermal conductivity are improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces traditional mechanical drilling and wiring methods with electrochemical deposition processes (electrolytic or electroless plating) to create conductive pillars. This substitution eliminates complex mechanical assembly steps, reduces manufacturing variability, and enables precise control of pillar dimensions and conductivity, improving electrical connectivity while the standardized plating processes keep manufacturing complexity manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of smaller, more reliable integrated circuit packages with improved thermal and electrical performance, supporting higher functionality and miniaturization needs by ensuring secure attachment and efficient electrical and thermal conductivity.
Implementation Method 1
conductive pillars built up over and electrically coupled to at least one of the conductive structures
Implementation Method 2
conductive pillars built up over and electrically coupled to at least one of the conductive structures
Data Source
AI summary
A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and electrically coupled to the conductive structures. A molding compound is formed over the first surface of the substrate.