Interconnect Substrate for Dies with Different Connector Sizes
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Solution Overview
Problem
The semiconductor industry faces challenges in packaging mechanisms for dies with different sizes of connectors, particularly in reducing manufacturing costs and efficiently forming die packages without using expensive interposers with through-substrate vias.
Innovation Solution
The development of a packaging mechanism that involves forming interconnect substrates without TSVs, using redistribution layers and conductive layers with solder and copper plating processes to create bonding structures, and employing a bonding scheme that saves manufacturing costs by avoiding substrates with high-cost TSVs, allowing for the integration of dies with varying connector sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If interposers with through-substrate vias (TSVs) are used to connect dies with different connector sizes, then electrical connections and adaptability are improved, but manufacturing cost increases
Solution Approach 1:
The interconnect substrate is divided into multiple regions with different connector sizes (first plurality of connectors and second plurality of connectors) without requiring through-substrate vias. This segmentation allows different dies with different connector sizes to be connected directly to the interconnect substrate, eliminating the need for expensive TSV-based interposers while maintaining adaptability.
Solution Approach 2:
The patent replaces expensive interposers with TSVs with a simpler, lower-cost interconnect substrate that uses surface-mounted connectors instead of through-substrate vias. This substitution uses cheaper manufacturing processes (such as plating and bonding structures on the surface) while achieving the same functional goal of connecting dies with different connector sizes.
2Reliability
If TSV-based interposers are used, then electrical connection reliability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts the through-substrate via (TSV) structure from the interconnect substrate design, eliminating the complex drilling, plating, and filling processes required for TSVs. Instead, the solution uses surface-mounted bonding structures and redistribution layers to achieve electrical connections, thereby reducing device complexity while maintaining reliability.
Solution Approach 2:
Rather than creating vertical through-substrate connections (TSVs), the patent inverts the approach by using surface-level bonding structures and redistribution layers to establish electrical connections. This inversion simplifies the substrate structure by avoiding the need for deep via holes and complex multi-layer TSV architectures.
3Productivity
If smaller feature sizes are used to increase integration density, then integration level is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent addresses the manufacturing precision challenge by moving from two-dimensional planar interconnects to three-dimensional bonding structures, including vertical bonding structures and multi-layer redistribution layers. This dimensional transition allows for higher integration density while maintaining manufacturability, as the vertical dimension provides additional space for interconnections without requiring proportionally smaller lateral feature sizes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the cost-effective formation of die packages with efficient electrical connections and heat dissipation, reducing waste and improving manufacturing efficiency by allowing for the use of alternative, lower-cost die package structures.
Implementation Method 1
using redistribution layers and conductive layers with solder and copper plating processes to create bonding structures
Implementation Method 2
using redistribution layers and conductive layers with solder and copper plating processes to create bonding structures
Data Source
AI summary
Embodiments of mechanisms for testing a die package with multiple packaged dies on a package substrate use an interconnect substrate to provide electrical connections between dies and the package substrate and to provide probing structures (or pads). Testing structures, including daisy-chain structures, with metal lines to connect bonding structures connected to signals, power source, and/or grounding structures are connected to probing structures on the interconnect substrate. The testing structures enable determining the quality of bonding and/or functionalities of packaged dies bonded. After electrical testing is completed, the metal lines connecting the probing structures and the bonding structures are severed to allow proper function of devices in the die package. The mechanisms for forming test structures with probing pads on interconnect substrate and severing connecting metal lines after testing could reduce manufacturing cost.