Interconnect Substrate EBG Noise Suppression
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Solution Overview
Problem
Existing interconnect substrates face challenges in suppressing electromagnetic leakage due to noise generated by electronic elements, particularly at high frequencies above 1 GHz, and require dedicated pads for components like bypass capacitors and line elements, which restrict circuit design flexibility and are ineffective against high-frequency noise.
Innovation Solution
An interconnect substrate with a laminated body comprising an electric conductor and insulator, featuring a first conductor in an island shape, a connecting member, and a second conductor positioned opposite to the first conductor with an insulator in between, where the second conductor is located within a quarter wavelength of the noise frequency, forming an Electromagnetic Band-Gap (EBG) structure to suppress noise leakage without the need for dedicated pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If bypass capacitors or line elements are used to suppress electromagnetic leakage, then electromagnetic leakage is reduced, but dedicated pads are required which limit circuit design flexibility
Solution Approach 1:
The power supply plane itself serves as the electromagnetic leakage suppression structure by controlling its spatial extent to be less than a quarter wavelength from the electronic element. The plane performs dual functions: providing power supply and suppressing electromagnetic leakage, eliminating the need for separate suppression components and their dedicated pads.
Solution Approach 2:
The invention changes the spatial parameter of the power supply plane by limiting its distance from the electronic element to less than a quarter wavelength at the noise frequency. This parameter modification enables the plane to function as an electromagnetic leakage suppression structure without requiring additional components.
2Object-affected harmful factors
If bypass capacitors or line elements are mounted to suppress high-frequency noise, then electromagnetic leakage is reduced, but manufacturing complexity increases due to additional components
Solution Approach 1:
The power supply plane performs self-service by inherently suppressing high-frequency noise leakage through its controlled spatial extent. This eliminates the need for separate bypass capacitors or line elements, reducing the total component count and manufacturing complexity while maintaining effectiveness against high-frequency noise.
Solution Approach 2:
The power supply plane is designed to perform multiple functions simultaneously: providing electrical power and suppressing electromagnetic leakage. This multi-functionality reduces the need for dedicated suppression components, thereby reducing device complexity and manufacturing steps.
3Object-affected harmful factors
If conventional electromagnetic leakage suppression methods are used, then some leakage is reduced, but they are ineffective against high-frequency noise of 1 GHz or more
Solution Approach 1:
The invention addresses high-frequency noise effectiveness by changing the spatial parameter of the power supply plane to be less than a quarter wavelength at the noise frequency (1 GHz or more). This parameter optimization ensures the plane functions as an effective electromagnetic leakage suppression structure at high frequencies where conventional methods fail.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses electromagnetic leakage from island-shaped planes and slits adjacent to the plane, providing enhanced noise reduction for high-frequency noise above 1 GHz without the need for dedicated pads, thus maintaining circuit design flexibility and improving noise suppression efficiency.
Implementation Method 1
forming an Electromagnetic Band-Gap (EBG) structure to suppress noise leakage
Data Source
AI summary
An interconnect substrate comprising a laminated body, including an electric conductor and an insulator, over which an electronic element is disposed, wherein the laminated body includes a first layer having at least one first conductor separated in an island shape, a first connecting member which is buried in the laminated body in order to electrically connect the electronic element and the first conductor, a second layer having a third conductor which is provided opposite to at least a partial region of the first conductor, a second conductor which is provided opposite to at least one of the first conductor and the third conductor with a layer of the insulator interposed therebetween, and a second connecting member, buried in the laminated body, which electrically connects the second conductor and the first conductor or the third conductor.