Interconnect Substrate Filler Pattern Identification Without Marking Space
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Solution Overview
Problem
Existing interconnect substrates require additional size for identification marks, leading to increased substrate size and complexity, making it challenging to create a compact version with embedded identification information.
Innovation Solution
An interconnect substrate comprising an insulating layer, a dispersion layer with unique filler patterns, and an interconnect layer, where the dispersion layer includes non-conductive fillers dispersed in a main material, forming identifiable patterns via image recognition, allowing for compact design and accurate identification without additional space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If identification marks are formed on the insulator at the boundary of each piece, then positional information can be determined, but the substrate size increases due to required marking spaces
Solution Approach 1:
The identification mark function is merged with the existing insulator material by dispersing fillers within it. This eliminates the need for separate marking spaces while maintaining identification capability, thereby reducing substrate size without sacrificing identification accuracy
Solution Approach 2:
The insulator is given non-uniform local quality through selective filler dispersion. Areas with different filler concentrations or patterns provide identification information, allowing the substrate to carry identification data within its existing structure rather than requiring additional dedicated marking areas
2Measurement precision
If identification marks are accurately embedded at predetermined positions, then identification is possible, but the device complexity increases due to additional marking processes
Solution Approach 1:
The identification marking function is combined with the insulator fabrication process itself. By incorporating fillers into the insulator material during its formation, the identification pattern is created as an integral part of the manufacturing process rather than as a separate post-processing step, thereby reducing overall process complexity
Solution Approach 2:
The identification pattern is prepared in advance by dispersing fillers within the insulator material during its formation. This preliminary incorporation of identification features eliminates the need for subsequent complex marking operations, simplifying the overall manufacturing process while ensuring accurate identification
Data Source
AI summary
An interconnect substrate includes an insulating layer, a dispersion layer, and an interconnect layer, the insulating layer, the dispersion layer, and the interconnect layer being laminated together, wherein the dispersion layer includes a main material and one or more fillers dispersed in the main material, the one or more fillers forming a unique dispersion pattern, and wherein the unique dispersion pattern is identifiable by image recognition from outside of the interconnect substrate.