Interconnect Substrate Nanoscale Grooves Adhesion Signal Loss
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Solution Overview
Problem
Existing techniques for improving adhesion between insulating and interconnect layers in substrates either fail to provide sufficient adhesion or have limited applicability due to surface irregularities and the use of primer layers, leading to increased signal transmission loss.
Innovation Solution
The formation of grooves with a meander shape on the order of nanometers on the surface of the insulating layer, which allows anchor portions of the interconnect layer to fit into these grooves, enhancing adhesion while minimizing signal transmission path length and maintaining satisfactory transmission characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If surface irregularities on the order of micrometers are formed in the insulating layer to improve adhesion, then adhesion between insulating layer and interconnect layer is improved, but signal transmission loss increases due to skin effect
Solution Approach 1:
The patent changes the scale parameter of surface irregularities from micrometer order to nanometer order. By forming grooves with widths of 1-100 nm (particularly 3-50 nm), the invention maintains adhesion improvement while avoiding the skin effect that occurs at micrometer scales, thus resolving the contradiction between adhesion and signal transmission loss
Solution Approach 2:
The patent applies local quality by creating nanoscale grooves only in specific regions where adhesion is needed, while maintaining a relatively smooth surface overall. The grooves are formed with specific dimensions (width 1-100 nm, depth 10-50 nm) to provide localized adhesion enhancement without affecting the overall signal transmission path
2Strength
If a primer layer is formed on the insulating layer surface to improve adhesion, then adhesion between insulating layer and interconnect layer is improved, but applicability is limited to certain materials
Solution Approach 1:
The patent extracts the adhesion-promoting function from material-specific primer layers and implements it through universal nanoscale groove structures. By removing the need for chemical primer layers and replacing them with physical nanoscale surface features, the invention achieves broad applicability across different material systems while maintaining effective adhesion
Solution Approach 2:
The nanoscale groove structure serves as a universal adhesion enhancement mechanism that can be applied to various insulating layer materials without requiring material-specific primer layers. This universal approach replaces the limited applicability of primer layers with broad compatibility across different material systems
Data Source
AI summary
An interconnect substrate includes an insulating layer and an interconnect layer formed on a surface of the insulating layer, wherein the surface of the insulating layer has grooves formed therein, the grooves having a meander shape on an order of nanometers in a plan view, and wherein the interconnect layer has anchor portions fitted into the grooves.