Interconnect Substrate Two-Layer Resin Adhesion
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Solution Overview
Problem
Adhesion between insulating layers containing fillers and interconnect layers in interconnect substrates is challenging due to the filler's interference, leading to potential peeling issues, especially when filler content exceeds 50 wt% and thermal stress is applied.
Innovation Solution
A two-layer resin structure is introduced, where a resin-rich first layer covers the interconnect layer's surface and a filler-rich second layer covers the first layer, with the first layer having a higher resin content per unit area than the second layer, enhancing adhesion without increasing surface roughness, which could cause signal delays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a roughening treatment is applied to the interconnect layer surface to create bumps and recesses for anchoring effect, then adhesion between insulating layers and interconnect layers is improved, but surface roughness increases which may cause signal delays
Solution Approach 1:
The insulating layer is divided into two distinct resin layers with different compositions: a first resin layer with high resin content (low filler content) that contacts the interconnect layer, and a second resin layer with lower resin content (high filler content) that covers the first layer. This segmentation allows each layer to perform its specific function optimally without compromising the other.
Solution Approach 2:
Different regions of the insulating layer are given different material compositions tailored to their specific functions. The first resin layer near the interconnect layer has optimized composition for adhesion (high resin, low filler), while the second resin layer has optimized composition for mechanical properties and insulation (low resin, high filler).
2Reliability
If filler content in the insulating layer is increased to exceed 50 wt%, then insulation performance and mechanical properties are improved, but adhesion to the interconnect layer deteriorates due to filler interference
Solution Approach 1:
The insulating layer is segmented into two resin layers with different filler contents. The first resin layer has low filler content (high resin proportion) to ensure good adhesion to the interconnect layer, while the second resin layer has high filler content (low resin proportion) to provide the required insulation performance and mechanical properties.
Solution Approach 2:
The insulating layer structure implements local quality by having the first resin layer near the interconnect layer composed primarily of resin with minimal filler for optimal adhesion, while the second resin layer further away contains high filler content for optimal insulation performance. Each region has material composition locally optimized for its specific function.
Data Source
AI summary
An interconnect substrate includes a first insulating layer, an interconnect layer formed on a first surface of the first insulating layer, and a second insulating layer formed on the first surface of the first insulating layer to cover the interconnect layer, wherein the second insulating layer includes a first resin layer and a second resin layer, the first resin layer covering at least part of a surface of the interconnect layer exposed outside the first insulating layer, the second resin layer covering the first resin layer, wherein both the first resin layer and the second resin layer contain a resin and a filler, and wherein a proportion of the resin in the first resin layer per unit area is higher than a proportion of the resin in the second resin layer per unit area.