Interconnect Substrate Resin Layer Structure for Warpage Control
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Solution Overview
Problem
Interconnect substrates with interposers mounted on build-up substrates face a risk of bonding failure due to stress-induced warpage, which can lead to uneven connections and detachment issues.
Innovation Solution
The interconnect substrate design incorporates an insulating resin layer with a first filler having a larger average particle diameter than a second filler, reducing internal stress and warpage, and featuring a redistribution layer and conductive via for electrical connectivity, along with a bonding material and adhesive layer for secure bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform insulating resin layer is used, then the manufacturing process is simple, but warpage occurs due to internal stress leading to bonding failure
Solution Approach 1:
The insulating resin layer is segmented into three distinct resin layers (first, second, and third resin layers) with different filler compositions. This segmentation allows each layer to contribute differently to stress distribution, preventing warpage while maintaining bonding reliability between the interposer and build-up substrate.
Solution Approach 2:
Each resin layer is assigned a specific filler composition tailored to its position: the first resin layer contains filler with 0.01-10 μm particles, the second resin layer contains filler with 0.01-5 μm particles, and the third resin layer contains filler with 0.01-1 μm particles. This local quality differentiation optimizes stress distribution across the layer thickness, preventing warpage without requiring complex overall structural changes.
2Stability of the object's composition
If filler particle size is uniform throughout the insulating resin layer, then material composition is simple, but stress distribution is uneven causing warpage
Solution Approach 1:
The filler particle size is locally optimized in each resin layer: larger particles (0.01-10 μm) in the first layer, medium particles (0.01-5 μm) in the second layer, and smaller particles (0.01-1 μm) in the third layer. This local quality gradient ensures uniform stress distribution throughout the insulating resin layer, preventing warpage while keeping each individual layer's composition relatively simple.
Solution Approach 2:
The insulating resin layer is constructed as a composite structure with three different resin compositions, each containing fillers with specific particle size ranges. This composite material approach allows the system to achieve uniform stress distribution through the combination of different filler sizes, which cannot be accomplished with a single uniform material composition.
Data Source
AI summary
An interconnect substrate includes an insulating resin layer having a first surface and a second surface opposite the first surface, a redistribution layer provided on the first surface of the insulating resin layer, a first connection terminal exposed at the second surface of the insulating resin layer, and a conductive via provided in the insulating resin layer to electrically connect the redistribution layer and the first connection terminal, wherein the insulating resin layer includes a first resin layer constituting the second surface and containing a first filler, a second resin layer provided on the first resin layer, and a third resin layer provided on the second resin layer, the third resin layer containing a second filler and constituting the first surface, and wherein an average particle diameter of the first filler is greater than an average particle diameter of the second filler.