Interconnect Substrate Warpage Control via Segmented Resin Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing interconnect substrates face challenges in reducing warpage, which affects their stability and usability in electronic applications.
Innovation Solution
The interconnect substrate design includes a core layer with a non-photosensitive thermosetting resin and through interconnects, combined with first and second interconnect structures laminated on either side, where the core layer has greater rigidity than the interconnect structures, and the second interconnect structure has a greater thickness than the first insulating layers, to reduce warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single insulating layer made of glass epoxy resin is used as the core substrate, then the substrate structure is simple, but warpage cannot be sufficiently reduced
Solution Approach 1:
The core substrate is divided into multiple insulating layers (first insulating layer, second insulating layer, third insulating layer) with different materials and positions. This segmentation allows each layer to contribute differently to warpage control, with the glass epoxy resin layer providing dimensional stability and the photosensitive resin layers enabling precise thickness control and additional warpage compensation.
Solution Approach 2:
The patent uses a composite structure combining glass epoxy resin (in the first insulating layer) with photosensitive resin (in the second and third insulating layers). This composite material approach leverages the dimensional stability of glass epoxy while utilizing the controllable curing and thickness properties of photosensitive resin to achieve superior warpage reduction that cannot be obtained with a single material.
2Stability of the object's composition
If the thickness of insulating layers is increased to reduce warpage, then warpage control improves, but the overall substrate thickness and device size increase
Solution Approach 1:
Different insulating layers are positioned at specific locations within the substrate structure to address warpage locally. The glass epoxy resin layer is positioned where dimensional stability is most needed, while photosensitive resin layers are placed to provide warpage compensation at critical interfaces. This localized quality assignment allows effective warpage control without uniformly increasing the thickness of the entire substrate.
Solution Approach 2:
The patent controls the thickness of each insulating layer within specific ranges (first insulating layer: 50-200 μm, second insulating layer: 10-50 μm, third insulating layer: 10-50 μm) to optimize the balance between warpage reduction and overall substrate thickness. By precisely controlling these parameters, the invention achieves effective warpage control while minimizing the increase in total substrate thickness.
3Stability of the object's composition
If reinforcement members are added to the core substrate to increase rigidity, then warpage reduces, but manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts the reinforcement function from traditional discrete reinforcement members (such as glass fiber mats or cloth) and integrates it into the insulating layers themselves. The glass epoxy resin layer provides inherent reinforcement through its material properties, eliminating the need for separate reinforcement components while simplifying the manufacturing process and reducing assembly steps.
Solution Approach 2:
The patent merges the reinforcement function with the insulating function by using glass epoxy resin as the material for the first insulating layer. This combination achieves both electrical insulation and mechanical reinforcement in a single integrated component, eliminating the need for separate reinforcement members and simplifying the overall manufacturing process.
4Stability of the object's composition
If multiple insulating layers with different materials are used to reduce warpage, then warpage control improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent replaces traditional mechanical thickness control methods with photochemical curing processes. The photosensitive resin layers are cured through photolithography, which provides precise thickness control through photographic patterning and controlled chemical reactions. This substitution of mechanical control with optical-chemical processes significantly improves manufacturing precision and reduces variability in layer thickness.
Solution Approach 2:
The patent specifies precise thickness ranges for each insulating layer (first: 50-200 μm, second: 10-50 μm, third: 10-50 μm) to optimize the balance between warpage reduction and manufacturing feasibility. These parameter specifications provide clear manufacturing targets that guide the photolithography and curing processes, ensuring consistent results while maintaining reasonable manufacturing precision requirements.
Data Source
AI summary
An interconnect substrate includes a core layer including a resin layer mainly composed of a non-photosensitive thermosetting resin and a through interconnect extending through the resin layer, the core layer having no reinforcement member contained therein, a first interconnect structure laminated on a first side of the core layer and including first interconnect layers and first insulating layers mainly composed of a photosensitive resin, and a second interconnect structure laminated on a second side of the core layer and including second interconnect layers and a single second insulating layer mainly composed of a photosensitive resin, wherein the first interconnect layers are electrically connected to the second interconnect layers via the through interconnect, wherein the core layer has greater rigidity than the first interconnect structure and the second interconnect structure, and wherein a thickness of the second interconnect structure is greater than a thickness of each of the first insulating layer.