Interconnect Track Structure That Blocks Oxidation Migration
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Solution Overview
Problem
Oxidation along interconnect tracks in integrated circuits, particularly in MMIC components, leads to delamination and electronic traps, affecting component performance due to humidity exposure and electric field migration.
Innovation Solution
Incorporating a blocking structure with a discontinuous oxidizable layer and a continuous conductive layer in the interconnect track, where the blocking structure is interposed between the carrier structure and the track, preventing oxidation propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the interconnect track is exposed to the external environment to allow signal transmission, then the component can communicate with the outside, but the interconnect track is susceptible to oxidation from humidity which migrates along the track toward the component
Solution Approach 1:
The oxidizable material layer is divided into discontinuous segments separated by blocking structures, creating isolated sections that prevent oxidation migration along the interconnect track while maintaining electrical continuity through the conductive material
Solution Approach 2:
Blocking structures are introduced as intermediary elements between the oxidizable material layers, acting as barriers that stop oxidation propagation while allowing the interconnect track to function normally
2Reliability
If a continuous layer of oxidizable material is used to support the conductive layer, then the interconnect track has good electrical continuity, but oxidation can propagate along the entire length of the track to the component
Solution Approach 1:
The continuous oxidizable material layer is segmented into discontinuous portions by blocking structures, creating isolated sections that prevent oxidation migration while the conductive material layer maintains electrical continuity across these sections
Solution Approach 2:
Different sections of the interconnect track are given different properties: areas with blocking structures have oxidation resistance, while areas without blocking structures maintain electrical conductivity, creating localized functional zones along the track
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents oxidation from reaching the component, maintaining interconnect track integrity and ensuring electrical continuity while being compatible with conventional production methods.
Implementation Method 1
oxidation that originates at the component cutting line can migrate along the interconnect track
Data Source
AI summary
An integrated electronic device includes at least one component produced on a carrier structure including a semiconductor substrate, and an interconnection track (8) that runs over the carrier structure from the component to a lateral face of the device. The interconnection track includes a layer of oxidizable material bearing a continuous layer of conductive material. The layer of oxidizable material is discontinuous. A method for producing such an integrated electronic device is also disclosed herein.