Interconnectable PCB Arrays for 3D Lighting and Heat Dissipation

Solution Overview

Problem

Existing lighting systems using multiple LEDs struggle to form three-dimensional shapes while maintaining electrical connectivity and mechanical stability, often requiring elaborate mechanical structures for heat dissipation and shape retention.

Innovation Solution

Interconnectable circuit boards with bendable board-to-board connectors that allow circuit boards to be angled and secured without additional mechanical support, enabling the formation of stable three-dimensional arrays with integrated heat dissipation through a simple mounting structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If standard rigid circuit board materials (FR4 or metal core) are used, then structural stability is improved, but the ability to form three-dimensional shapes is worsened

Engineering Contradiction:

Improvestructural stabilityVSAvoidability to form three-dimensional shapes

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The lighting system is divided into multiple separate circuit board assemblies that can be individually handled and connected. Each assembly contains LEDs and can be independently positioned, allowing the overall structure to form three-dimensional shapes while each rigid board maintains its structural stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple circuit board assemblies are nested or interconnected through mechanical structures and heat sinks, forming a hierarchical three-dimensional structure where rigid boards are integrated into a larger flexible configuration.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If multiple circuit board assemblies are connected to form three-dimensional shapes, then adaptability is improved, but device complexity is worsened

Engineering Contradiction:

Improveability to form three-dimensional shapesVSAvoidmechanical structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The mechanical support structure and heat dissipation function are merged into a single integrated heat sink structure. This eliminates the need for separate mechanical support elements, reducing overall device complexity while enabling three-dimensional configurations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat sink serves multiple functions: it dissipates heat from the LEDs, provides mechanical support for the circuit board assemblies, and enables the three-dimensional geometric configuration. This multi-functionality reduces the number of separate components needed.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If elaborate mechanical structures are added for heat dissipation and shape retention, then reliability is improved, but device complexity is worsened

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmechanical support structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The mechanical support structure and heat dissipation function are merged into a single integrated heat sink structure. This eliminates the need for separate mechanical support elements, reducing overall device complexity while enabling three-dimensional configurations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat sink serves multiple functions: it dissipates heat from the LEDs, provides mechanical support for the circuit board assemblies, and enables the three-dimensional geometric configuration. This multi-functionality reduces the number of separate components needed.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250008653A1Interconnectable circuit boards adapted for three-dimensional constructions as lighting sources

Publication Date: 2025.01.02 METROSPEC TECHNOLOGY LLC

AI summary

Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.