Microelectronic Package with Interconnected Chips on Leadframe
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current integrated circuit technologies face challenges in reducing the pin-out count and size of microelectronic packages, leading to increased complexity and cost, as well as space consumption on system-level boards, due to the need for multiple packages and complex interconnections.
Innovation Solution
A microelectronic package design featuring multiple integrated circuit chips mounted on a leadframe with bonding fingers, where the chips are interconnected directly within the package, reducing the need for dedicated pins and allowing for a more compact configuration by using adhesive materials and fusing bonding fingers for enhanced mechanical strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple packages are used to achieve required functionalities, then the pin-out count and space requirements increase, but the reliability and functionality are improved
Solution Approach 1:
The patent combines multiple integrated circuit chips (first chip and second chip) into a single microelectronic package, merging their functionalities and reducing the number of separate packages needed. This directly addresses the contradiction by improving functionality through integration while reducing the total space occupied on the system-level board.
Solution Approach 2:
The leadframe structure is designed to support multiple chips with different functionalities (signal processing, power, ground) within a single package, creating a multi-functional universal package that replaces multiple single-function packages, thereby reducing space requirements while maintaining enhanced functionality.
2Reliability
If multiple packages are used to achieve required functionalities, then the pin-out count increases, but the reliability and functionality are improved
Solution Approach 1:
By merging multiple chips into one package with shared bonding fingers and interconnected substrates, the patent reduces the total pin-out count compared to using separate packages, while maintaining the functional reliability through direct inter-chip connections within the integrated package structure.
Solution Approach 2:
The patent utilizes vertical stacking and three-dimensional arrangement of chips on the leadframe, moving from a two-dimensional planar arrangement of separate packages to a multi-layered integrated structure, thereby reducing pin-out complexity while preserving functionality.
3Ease of manufacture
If standard single-chip packages are used instead of multichip packages, then manufacturing cost is reduced, but the spacing impact and complexity of packaging operations are not reduced
Solution Approach 1:
The leadframe is pre-configured with multiple bonding fingers and interconnection structures before chip mounting, allowing for streamlined packaging operations. This preliminary preparation of the leadframe structure enables efficient assembly of multiple chips without increasing operational complexity, maintaining ease of manufacture.
4Device complexity
If chips are interconnected within the same package, then the pin-out count is reduced, but the manufacturing precision and assembly complexity increase
Solution Approach 1:
The bonding fingers are designed to self-align and self-secure the chips in place during assembly, reducing the need for high-precision external alignment processes. The mechanical interlocking features and adhesive application methods enable automated assembly with standardized precision requirements, mitigating the increase in manufacturing precision demands.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the pin-out count, minimizes space requirements, and lowers manufacturing costs by enabling efficient interconnection of multiple chips within a single package, while maintaining electrical integrity and mechanical stability.
Implementation Method 1
the first integrated circuit chip may be mounted onto the surface using an adhesive. In some of the embodiments, the adhesive is a die-attach film.
Implementation Method 2
at least a portion of a first bonding finger may be fused to at least a portion of a second bonding finger
Data Source
AI summary
Described herein are microelectronic packages including a plurality of bonding fingers and multiple integrated circuit chips, at least one integrated circuit chip being mounted onto the bonding fingers. According to various embodiments of the present invention, mounting the integrated circuit chip onto the bonding fingers may reduce the pin-out count by allowing multiple integrated circuit chips to be interconnected within the same microelectronic package. Other embodiments may be described and claimed.