Interconnected Electrode Structure for Stable Through-Hole Conductive Channels
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Solution Overview
Problem
The challenge in manufacturing transparent electrodes lies in achieving reliable conductive channels through insulating layers without contaminating the conductive surface, as existing methods face issues with conductive slurry stability and leakage, leading to high technological difficulty and low yield.
Innovation Solution
An interconnected electrode structure is created by forming through holes in an insulating base material and filling them with conductive slurry from one surface, while a second conductive body is added from the opposing surface to form a conductive channel, ensuring electrical connection without leakage, using a method that adjusts viscosity and surface tension to maintain stability during the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through hole is filled with conductive slurry to create a conductive channel through the insulating layer, then electrical connectivity is achieved, but the conductive liquid flows out from the bottom of the through hole causing contamination and manufacturing failures
Solution Approach 1:
A conductive layer is formed on the rear surface of the substrate before filling the through hole with conductive slurry. This preliminary conductive layer acts as a barrier to prevent the conductive liquid from flowing out and contaminating the rear surface, while still allowing electrical connectivity to be achieved.
Solution Approach 2:
The conductive layer formed on the rear surface serves as an intermediary barrier between the conductive slurry in the through hole and the rear surface of the substrate. It prevents direct contact and contamination while maintaining the electrical conduction path.
2Strength
If the insulating layer thickness is increased to ensure mechanical strength and insulation performance, then structural integrity is improved, but the complexity of wiring through the insulating layer increases
Solution Approach 1:
The conductive path is segmented into multiple parts: conductive layers on both surfaces of the insulating layer, and conductive slurry filling the through hole. This segmentation allows the insulating layer to maintain its thickness for mechanical strength while still achieving electrical connectivity through the combined conductive elements.
3Ease of manufacture
If conductive slurry is used to fill the through hole, then manufacturing cost is reduced compared to other methods, but the liquid easily flows out and cuts off the conductive channel
Solution Approach 1:
The conductive layer on the rear surface acts as an intermediary barrier that prevents the conductive slurry from flowing out while still allowing the manufacturing process to use the cost-effective conductive slurry filling method.
Solution Approach 2:
The physical state of the conductive material is changed from purely liquid slurry to a combination of conductive layer and conductive slurry. The conductive layer provides a solid barrier while the conductive slurry provides the filling function, changing the parameters of the conductive system to achieve both cost-effectiveness and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enhances yield by ensuring stable conductive channels, suitable for applications in OLEDs, photovoltaic batteries, and other photoelectric devices with improved electrical conductivity and reduced resistance.
Implementation Method 1
a first conductive body, formed by conductive slurry that enters the through hole from an opening of the through hole on the first surface... a second conductive body, formed by a second conductive material that enters the through hole from an opening of the through hole on the second surface, and also electrically combined with the first conductive body to form a conductive channel
Data Source
AI summary
An interconnected electrode structure, a method of manufacturing same, and a use of same are provided. The interconnected electrode structure includes an insulating base material, a through hole, a first conductive body, and a second conductive body. The insulating base material includes a first surface and a second surface which face away from each other. The through hole penetrates through the insulating base material in a thickness direction. The first conductive body is formed by conductive slurry that enters the through hole from an opening of the through hole on the first surface. The second conductive body is formed by a second conductive material that enters the through hole from an opening of the through hole on the second surface, and the second conductive body is electrically combined with the first conductive body to form a conductive channel in the insulating base material.