Interconnected Groove Structure for Display Device Locking Holes
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Solution Overview
Problem
Conventional methods for forming locking holes on the rear plate of display devices are slow and costly, using CNC tools.
Innovation Solution
A structure comprising a first metal layer, a second metal layer, and a buffer layer with interconnected grooves and a through hole, allowing for efficient stamping processes to form grooves and through holes, thereby improving manufacturing speed and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If CNC tools are used to form locking holes on the rear plate, then the locking holes can be precisely formed, but the manufacturing speed is slow and the manufacturing cost is high
Solution Approach 1:
The patent changes the manufacturing method from CNC machining to stamping process, altering the process parameters and formation mechanism. The stamping process uses mold cavities and pressure to form grooves and through-holes simultaneously, achieving both precision and high speed production
Solution Approach 2:
The patent pre-forms grooves in the metal layers before creating through-holes. These pre-formed grooves guide the stamping process and enable precise through-hole formation without requiring subsequent machining operations, thus improving both precision and productivity
2Manufacturing precision
If CNC tools are used to form locking holes on the rear plate, then the locking holes can be formed with controlled dimensions, but the manufacturing cost is expensive
Solution Approach 1:
The patent transitions from expensive CNC machining to cost-effective stamping processes. The stamping method uses simple mold cavities and bulk forming, significantly reducing tooling costs and per-unit manufacturing costs while maintaining dimensional control through precise mold design
Solution Approach 2:
The patent combines multiple operations (groove formation and through-hole creation) into a single stamping process. This integration eliminates multiple setup and machining steps, reducing both manufacturing cost and complexity while maintaining precision through the unified mold cavity design
Data Source
AI summary
An electric device including a first metal layer, a second metal layer, and a buffer layer. The first metal layer includes a first groove. The second metal layer includes a second groove. The buffer layer is located between the first metal layer and the second metal layer. A through hole passes through the first metal layer, the buffer layer and the second metal layer. The bottom of the first groove is interconnected with the bottom of the second groove via the through hole. The width of the second groove is greater than the width of the first groove.