Interconnection Structure for Multi-GPU Power Routing Off the System Board

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Solution Overview

Problem

High-performance computing systems require increased power routing paths to support multiple graphics processing units, leading to larger system boards and higher manufacturing costs due to varying voltage and power requirements.

Innovation Solution

The electronic device incorporates an interconnection structure that receives power from a power supply unit and distributes it to processing units without passing through the system board, providing multiple power paths and reducing electromagnetic interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If more power routing paths are added to support multiple GPUs with varying voltage and power requirements, then the power supply capability is improved, but the system board size and manufacturing cost increase

Engineering Contradiction:
Improvepower supply capabilityVSAvoidsystem board size
Core Design Contradiction:
PowerVSArea of stationary object

Solution Approach 1:

The invention segments the power distribution function by introducing separate power delivery carriers for different voltage domains (e.g., 12V and 5V power paths). Each carrier handles specific power routing independently, allowing multiple GPUs to receive appropriate power without requiring a larger system board. The segmentation of power paths into distinct carriers resolves the contradiction by providing enhanced power capability while maintaining compact board size.

Inventive Principle:
Principle #1Segmentation

2Power

If more power routing paths are added to support multiple GPUs with varying voltage and power requirements, then the power supply capability is improved, but the manufacturing cost increases

Engineering Contradiction:
Improvepower supply capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
PowerVSEase of manufacture

Solution Approach 1:

The power distribution system is segmented into modular carriers, each responsible for specific voltage domains and power routing paths. This modular segmentation allows for standardized manufacturing of individual carriers that can be assembled into different configurations based on GPU requirements, reducing overall manufacturing complexity and cost while maintaining high power supply capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The power delivery carriers are designed with universal interfaces and standardized power routing paths that can serve multiple GPU types and configurations. This multi-functionality allows a single carrier design to support various power requirements (different voltages, different numbers of GPUs), reducing the need for custom-designed boards and thereby lowering manufacturing costs while maintaining flexibility in power supply capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If power is transmitted through the system board to multiple electronic devices, then the system board structure is simplified, but electromagnetic interference between power paths increases

Engineering Contradiction:
Improvesystem board structureVSAvoidelectromagnetic interference
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The invention segments power transmission into separate physical carriers for different voltage domains and power paths. By physically separating the 12V power path from the 5V power path through distinct carriers rather than routing all power through a single system board trace structure, electromagnetic interference between power paths is minimized while maintaining a relatively simple overall system architecture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The power delivery carriers act as intermediary structures between the power source and the GPUs. These intermediate carriers provide isolated power routing paths that mediate the power transmission process, preventing direct electromagnetic coupling between different power paths that would occur if all power were routed through the system board traces, thereby reducing electromagnetic interference while preserving structural simplicity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11991827B2Electronic device
Publication Date: 2024.05.21 ADVANCED SEMICON ENG INC
  • US11991827B2 patent drawing
  • US11991827B2 patent drawing
  • US11991827B2 patent drawing

AI summary

An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.