Interconnection Structure with Side Connection Pads for Wiring Routing
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Solution Overview
Problem
Existing interconnection structures using organic substrates restrict wiring routing and terminal layout flexibility due to the presence of interconnection members like silicon bridges, making it difficult to route power and ground terminals effectively.
Innovation Solution
An interconnection structure with a base substrate, conductive pads, and an interconnection layer featuring side connection pads exposed at its edge, allowing for novel side connections that enhance wiring flexibility and optimize terminal layout, while using insulation material and barrier metals to improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interconnection members like silicon bridges are used on organic substrate, then interconnections between chips can be established, but wiring routing flexibility and terminal layout flexibility are restricted
Solution Approach 1:
The patent introduces side connection pads at the edge of the interconnection layer, adding a lateral connection dimension beyond traditional top-surface connections. This enables wiring to route through the side of the interconnection layer, providing alternative paths that bypass restrictions imposed by conventional interconnection member layouts.
2Reliability
If interconnection members like silicon bridges are used on organic substrate, then interconnections between chips can be established, but terminal layout is restricted
Solution Approach 1:
By exposing connection pads at the edge of the interconnection layer, the patent creates additional terminal access points in the lateral dimension. This allows ground and power supply terminals to be positioned and routed more freely, relaxing constraints on terminal layout while maintaining reliable interconnections.
3Ease of manufacture
If conventional interconnection structures are used, then chip mounting is possible, but wiring optimization is limited
Solution Approach 1:
The patent segments the connection function into multiple independent side connection pads distributed around the edge of the interconnection layer. This segmentation allows different portions of the wiring to be optimized independently, enabling better performance tuning while maintaining ease of chip mounting through the preserved bond pad interface.
Data Source
AI summary
An interconnection structure is disclosed. The interconnection structure includes a base substrate, a set of conductive pads disposed on the base substrate and an interconnection layer disposed on the base substrate. The interconnection layer has an edge located next to the set of the conductive pads and includes a set of side connection pads located and disposed at the edge of the interconnection layer. Each side connection pad is arranged with respect to a corresponding one of the conductive pads disposed on the base substrate.