Interconnection Substrate Structure for Rigid Yet Adaptable Routing
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Solution Overview
Problem
Existing interconnection substrates face challenges in achieving a balance between rigidity and flexibility, as well as limitations in the dimensions and materials of the interconnection network, particularly in radio frequency applications.
Innovation Solution
An interconnection substrate design featuring a thermomechanical support with electric interconnection holes, embedded metal tracks and vias, and protruding metal tracks, combined with a molding resin process to enhance rigidity and flexibility, allowing for varied dimensions and materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a substrate uses traditional metal layers and insulating layers to form an interconnection network, then it provides electrical coupling capability, but it suffers from limited rigidity and strength
Solution Approach 1:
The patent employs composite materials by combining metal tracks and vias with insulator layers within a thermomechanical support. This composite structure integrates conductive and insulating properties in a single substrate, enhancing both strength and electrical coupling capability without requiring separate layers, thus improving strength while managing structural complexity.
Solution Approach 2:
The interconnection network is segmented into multiple levels with metal tracks at different heights, connected by metal vias. This segmentation allows independent optimization of each level's function, enabling the substrate to achieve both mechanical strength through the thermomechanical support and electrical coupling through the segmented interconnection network, resolving the contradiction between strength and structural complexity.
2Adaptability or versatility
If the substrate dimensions and materials are standardized, then manufacturing is simplified, but flexibility in adapting to different electronic components is reduced
Solution Approach 1:
The patent enables parameter changes by allowing the interconnection network dimensions, such as track width, via diameter, and spacing, to be adjusted according to different electronic component requirements. The thermomechanical support maintains structural integrity while the interconnection network parameters can be customized, achieving adaptability without significantly complicating manufacturing through standardized processes.
Solution Approach 2:
The substrate design achieves universality by creating a multi-functional interconnection network that can accommodate different electronic components through parameter adjustments. The same basic structure with metal tracks, vias, and insulator layers can be adapted for various applications by changing dimensional parameters, providing versatility while maintaining manufacturing simplicity through a unified fabrication approach.
3Ease of manufacture
If metal vias are embedded flush with the insulator layer surface, then subsequent processing is simplified, but additional manufacturing steps are required
Solution Approach 1:
The patent applies preliminary action by forming metal vias to the correct height and embedding them flush with the insulator layer surface during the initial manufacturing stages. This preliminary positioning of vias eliminates the need for subsequent height adjustment operations, simplifying later processing steps. Although additional steps are required initially, the overall manufacturing process is streamlined by preventing the need for complex post-processing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate achieves improved rigidity and strength while maintaining flexibility in dimensions and materials, reducing deformation and breakage risks, and enabling a wider choice of insulating materials with advantageous properties.
Implementation Method 1
coating said at least one metal track and said at least one metal via in a molding resin to form an insulator layer
Implementation Method 2
forming at least one metal track by plating, forming at least one metal via by pillar plating from said at least one metal track
Data Source
AI summary
An interconnection substrate includes a thermomechanical support crossed by at least one electric interconnection hole. A first interconnection network is formed on a first surface of the thermomechanical support and a second interconnection network is formed on a second surface of the thermomechanical support. Each interconnection network includes and interconnection level formed by at least one metal track from which at least one metal via extends. The at least one metal track and the at least one metal via are embedded in an insulator layer so that the at least one metal via is flush with a surface of the insulator layer most distant from the thermomechanical support. At least one metal track protrudes from the insulator layer of the last interconnection level. The metal vias are configured to electrically couple together two adjacent levels and/or the last level with the at least one protruding metal track.