Interconnection Substrate With Programmable Disconnection Traces

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Solution Overview

Problem

Existing interconnection substrates lack flexibility and adaptability, as their electrical connection patterns cannot be modified after production, limiting their application in scenarios requiring changes in electrical interconnections between components.

Innovation Solution

The interconnection substrate features a design with multiple connecting units arranged in rows and columns, with additional conductive traces allowing for disconnections at specific points, enabling post-assembly configuration of electrical connections through punching or etching, and a programmable punching equipment for creating various electrical circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a specific connection pattern is designed on the interconnection substrate, then the electrical function is determined, but the adaptability to modify electrical connections after production is lost

Engineering Contradiction:

Improveadaptability to modify electrical connectionsVSAvoidcomplexity of connection pattern design

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-configuring the interconnection substrate with a standardized grid of connecting units, pads, and conductive traces before component assembly. This preliminary structure enables post-assembly customization of electrical connections through selective disconnection, resolving the contradiction between determining electrical function and maintaining adaptability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent segments the connection pattern into discrete connecting units arranged in rows and columns, with individual pads and conductive traces that can be selectively disconnected. This segmentation allows customization of electrical connections after production without requiring complete redesign, addressing the adaptability versus complexity contradiction.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If multiple versions of electrical interconnection are provided, then the flexibility for different applications is improved, but the manufacturing process complexity increases

Engineering Contradiction:

Improveflexibility for different applicationsVSAvoidease of manufacturing process

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent implements preliminary action by pre-manufacturing interconnection substrates with complete sets of connecting units, pads, and conductive traces in a standardized configuration. This preliminary preparation enables multiple electrical interconnection versions to be created through simple post-assembly disconnection operations, maintaining ease of manufacture while achieving flexibility for different applications.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent applies universality by designing a standardized interconnection substrate with connecting units, pads, and conductive traces that can serve multiple electrical connection configurations. This universal base structure allows the same substrate to be adapted for different applications through selective disconnection, resolving the contradiction between flexibility and manufacturing simplicity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If additional conductive traces are provided for subsequent disconnections, then the ability to create various electrical circuits is improved, but the initial substrate complexity increases

Engineering Contradiction:

Improveability to create various electrical circuitsVSAvoidcomplexity of substrate pattern

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent segments the conductive path into discrete connecting units with individual pads and traces arranged in a grid pattern. This segmentation allows selective disconnection at specific points to create various electrical circuits, improving adaptability while keeping the substrate pattern manageable through modular organization.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies preliminary action by pre-configuring the substrate with additional conductive traces and connecting units that enable future disconnection operations. This preliminary preparation of the substrate pattern allows various electrical circuits to be created later without requiring complex real-time manufacturing processes.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentEP2853140B1Interconnection substrate and method of manufacturing the same

Publication Date: 2020.07.29 LINXENS HOLDING SAS

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AI summary

The invention relates to an interconnection substrate for electronic components and a method for manufacturing the same. The interconnection substrate comprises rows and columns of connecting units (300). These connecting units (300) are electrically connected with an array of first (16), second (17) and third (18) connection traces designed so as to allow, without changing the electrical pattern of the interconnection substrate, a subsequent manufacturing of sets of connecting units (300) with various numbers of connecting units (300).